Effects of Heat Generation on Microstructure and Hardness of Cu/SiCp Surface Composite Processed by Friction Stir Processing

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Abstract:

In this investigation, copper (Cu) based surface composites reinforced with silicon carbide (SiC) particles were fabricated using friction stir processing (FSP) route. FSP was carried out considering three-factor three-level Box-Behnken design to study the effects of process parameters on peak temperature and hardness of Cu/SiCp surface composites. Microstructural evaluation using optical microscope (OM) revealed that SiCp were uniformly distributed and well – bonded with copper matrix at an adequate heat input conditions. The microhardness of the surface composites were remarkably enhanced than that of base metal. Regression models have been developed for predicting peak temperature and microhardness of processed surface composites and the same were in good agreement with experimental results.

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Materials Science Forum (Volumes 830-831)

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472-475

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September 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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