Corrosion Study of SAC305 Solder in Acidic Solution

Nurwahida Mohd Zaini; Muhammad Firdaus Mohd Nazeri

doi:10.4028/www.scientific.net/MSF.840.336

Paper Titles

The Cutting Speed Influences on Tool Wear of ZTA Ceramic Cutting Tools and Surface Roughness of Work Material Stainless Steel 316L during High Speed Machining
p.315

Production of Stainless Steel 316L Foam with Different Solid Loading
p.321

Effect of NaNO₃ as Enhancer on YBa₂Cu₄O₈ Superconductor Phase Formation via Solid State Technique with Heating at Ordinary Oxygen Pressure
p.326

Characterisation of WC-17Co and WC-9Ni HVOF Sprayed Cermet Coatings
p.331

Corrosion Study of SAC305 Solder in Acidic Solution
p.336

Studies on Adsorption-Desorption of CO₂ by Long Chain Fatty Amine Supported on SiO₂
p.343

Preparation of Activated Carbon from Walnut Shell Doped La and Ca Catalyst for Biodiesel Production from Waste Cooking Oil
p.348

Synthesis and Characterization of Silica-Alumina Supported Ca and Ni Catalyst for Deoxygenation of Vegetable Oil into Diesel
p.353

Synthesis of Aluminium Hydroxide and Alumina by Hydrothermal and Solvothermal Methods
p.359

HomeMaterials Science ForumMaterials Science Forum Vol. 840Corrosion Study of SAC305 Solder in Acidic...

Corrosion Study of SAC305 Solder in Acidic Solution

Abstract:

Corrosion resistance performance of Sn-3.0Ag-0.5Cu (SAC305) was evaluated in 1 M hydrochloride acid through potentiodynamic polarization. SAC305 shows active-passive corrosion behavior in acidic solution with two dissolution peaks detected in anodic branch. Microstructure analysis revealed that the corrosion product deposited on the surface after polarization was porous and uneven. This limits the protection offered by the passivation film as the porous structure allows further corrosion attack on the underlying solder.

You might also be interested in these eBooks

Development and Investigation of Materials Using Modern Techniques

View Preview

Info:

Periodical:

Materials Science Forum (Volume 840)

Pages:

336-339

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.840.336

Citation:

Cite this paper

Online since:

January 2016

Authors:

Nurwahida Mohd Zaini, Muhammad Firdaus Mohd Nazeri*

Keywords:

Acidic Solution, Corrosion, Failure Analysis, Lead-Free Solder, SAC305

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] D.R. Frear, Trends and issues in Pb-free soldering for electronic packaging, Elektrotechnik und Informationstechnik, 118 (2001) 81-86.

DOI: 10.1007/bf03157756

Google Scholar

[2] K. Suganuma, Advances in lead-free electronics soldering, Curr. Opin. Solid State Mater. Sci. 5 (2001) 55-64.

Google Scholar

[3] M. Abtew, G. Selvaduray, Lead-free solders in microelectronics, Mater. Sci. Eng. R-Rep. 27 (2000) 95-141.

DOI: 10.1016/s0927-796x(00)00010-3

Google Scholar

[4] N.C. Lee, Lead-free soldering-Where the world is going, Advancing microelectronics, 26(5) (1999) 29-35.

Google Scholar

[5] K. Suganuma, K.S. Kim, Sn-Zn low temperature solder, in: Lead-Free Electronic Solders, Springer, 2007, pp.121-127.

DOI: 10.1007/978-0-387-48433-4_7

Google Scholar

[6] M.C. Liew, I. Ahmad, L.M. Lee, M.F.M. Nazeri, H. Haliman, A.A. Mohamad, Corrosion behavior of Sn-3. 0 Ag-0. 5 Cu lead-free solder in potassium hydroxide electrolyte, Metall. Mater. Trans. A 43 (2012) 3742-3747.

DOI: 10.1007/s11661-012-1194-5

Google Scholar

[7] H.S. Mohran, A.R. El-Sayed, H.M.A. El-Lateef, Anodic behavior of tin, indium, and tin-indium alloys in oxalic acid solution, J. Solid State Electrochem. 13(8) (2009) 1279-1290.

DOI: 10.1007/s10008-008-0676-2

Google Scholar