Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid

Abstract:

Stainless steel will become one of the substrate materials used in flexible display. In this paper, the influence of the ferric chloride and the oxalic acid on the material removal rate (MRR) and surface roughness had been studied in the chemical mechanical polishing (CMP) 304 stainless steel. By analysis and research, the slurry ingredients based on the type of ferric chloride and oxalic acid had been obtained. The experimental results show that, the material removal rate reached more than 200nm/min. By the qualitative analysis on the phases of the surface material of 304 stainless steel using X-ray diffraction (XRD) after CMP, it is proved that the ferric chloride based slurry did not change the original phases and did not affect the performance of 304 stainless steel. The research results of this paper can provide the reference for the study the CMP slurry of 304 stainless steel.

• Periodical: Materials Science Forum (Volume 861)
• Pages: 102-107
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.861.102
• Online since: July 2016
• Authors: Jian Xiu Su*, Jia Peng Chen, Qing Li, Hong Quan Qin
• Keywords: 304 Stainless Steel, Chemical Mechanical Polishing, Material Removal Rate, Oxidizing Agent, Polishing Slurry

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