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Paper Titles
Preface, Committees, Sponsors
Fabrication of Nanotwinned Surface on a Nickel Alloy Using a Developed Diamond Panel with Tips Array
p.3
Simulation Research for the Effect of KDP Crystal Defect and Initial Internal Stress on Sawing Stress
p.9
Effects of Electricity Parameters on Surface Quality of Reaction Bonded Silicon Carbide Ceramic with Electrical Discharge Diamond Grinding
p.15
A Mechanical Model of Diamond Wire Sawing of Steel Structures
p.22
Grinding of Riblets on Curved Paths
p.28
New Evaluation Method of Polishing Pad Property for Estimating Edge Roll-Off of Silicon Wafer
p.34
Development of a Novel Shell Shaping Method with CFRTP: Forming Experiment Using Localized Heating in Processing Point
p.40
Effects of Cutting Atmosphere on High-Speed End Milling Process for Titanium Alloy Ti6Al4V
p.46
HomeMaterials Science ForumMaterials Science Forum Vol. 874Preface, Committees, Sponsors

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Materials Science Forum (Volume 874)

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October 2016

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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