Stochastic Simulation of Tape Grinding for Wafer-Like Workpiece

Keita  Shimada; Ayaka Watanabe; Yoshifumi Takasu; Masayoshi  Mizutani; Tunemoto Kuriyagawa

doi:10.4028/www.scientific.net/MSF.874.91

Paper Titles

Adaptive Grinding Strategy Development
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Optimization of the Removal Function of Dual-Rotation Magnetorheological Finishing
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A Novel Method for Grinding Wheel Setting Based on Acoustic Emissions
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Centrifugal Internal Grinding by Assembled Wheel with Radially Mobile Segments
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Stochastic Simulation of Tape Grinding for Wafer-Like Workpiece
p.91

Grinding Characteristics of Waspaloy with High-Speed Reciprocation Grinding
p.97

Cylindrical Grinding by Structured Wheels
p.101

Cutting Performance of PCD Tools Improved by Ultraviolet-Ray Irradiation Polishing
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Grinding of Cermets with Cup-Wheels
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HomeMaterials Science ForumMaterials Science Forum Vol. 874Stochastic Simulation of Tape Grinding for...

Stochastic Simulation of Tape Grinding for Wafer-Like Workpiece

Abstract:

Advanced semiconductor materials including silicon carbide and gallium nitride possess excellent properties like high hardness, and high heat and chemical resistance compared to silicon. Such properties reversely prevent efficient production of wafers, therefore a new wafer finishing method, tape grinding, is developed to improve productivity. This paper proposes a simulation method of tape grinding, which method is developed by modifying the stochastic approach developed for plunge grinding. The distribution of abrasive grains on the grinding tape is represented by number density, and the material existence probability that is represented by Abbott-Firestone curve is modified by considering machining parameters. Tape grinding process were then conducted to confirm the calculation method.

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Periodical:

Materials Science Forum (Volume 874)

Pages:

91-96

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.874.91

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Online since:

October 2016

Authors:

Keita Shimada*, Ayaka Watanabe, Yoshifumi Takasu, Masayoshi Mizutani, Tunemoto Kuriyagawa

Keywords:

Stochastic Simulation, Tape Grinding, Wafer Process

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