Deformation and Failure of Ultrafine-Grained Cu at Subambient Temperature

Abstract:

The ultrafine-grained copper was obtained by 12 passes of equal-channel angular pressing method. The uniaxial tensile tests at room temperature and the subambient temperature of 77 K show that the yield stress increases from the value of 128 MPa to the value of 138 MPa, respectively. In addition, the lowering the test temperature tends to the increase of the deformation before the failure. The fractographic analysis shows the transcrystalline ductile failure for all samples. Due to the high plasticity of nanostructured copper no influence of the nanoporosity on the failure process was observed.

• Periodical: Materials Science Forum (Volume 891)
• Pages: 249-253
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.891.249
• Online since: March 2017
• Authors: Alena Juríková*, Kornel Csach, Jozef Miškuf, Maria Hurakova, Elena D. Tabachnikova, Aleksey V. Podolskiy
• Keywords: Equal Channel Angular Pressing (ECAP), Fracture, Plastic Deformation, Ultrafine-Grained Copper

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