High Temperature Resistance of Polyborosilazane/Epoxy Resin Curing System

Abstract:

In this paper, Polyborosilazane (PBSZ) was successfully synthesized and used as curing agents for epoxy resin. FTIR, TGA, XRD, SEM were used to analyze the curing mechanism, curing temperature and thermal stability of the curing system. The results indicated that PBSZ could be used as curing agents for bisphenol A epoxy resin when its usage amount was 30-60 wt.% at the temperature between 100 ∼ 150 °C. Additionally, the thermal stability of PBSZ cured epoxy resin samples were better than that of epoxy resin cured with 4, 4-diaminodiphenylsulfone (DDS), showing a higher residual weight at 900°C. As PBSZ content increased, the residual weight of PBSZ cured epoxy resin at 900°C increased. When PBSZ content was 30%, the surface of cured epoxy resins was smooth without obvious defects. However, the surface became coarse when PBSZ content was further increased.

• Periodical: Materials Science Forum (Volume 898)
• Pages: 2294-2301
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.898.2294
• Online since: June 2017
• Authors: Chen Yu Zhang, Yong Liu, Ke Qing Han*, Xue Feng Chang, Mu Huo Yu
• Keywords: Curing Agent, Epoxy Resin, High Temperature Resistance, Polyborosilazane

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