Increasing the Work of the Diamond Grinding Circuits for the Account of Directed Changes in the Heat Conductivity of a Polymer Matrix

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Abstract:

Numerical simulation has been used to study the temperature field in a diamond-containing composite on a polymer matrix. It is shown that an increase in the thermal conductivity of the matrix due to fillers provides a reduction in the thermal load on the polymer binder.

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84-88

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October 2018

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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