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HomeMaterials Science ForumMaterials Science Forum Vol. 964Interfacial Reaction between Sn and Cu-Ti Alloy...

Interfacial Reaction between Sn and Cu-Ti Alloy (C1990HP)

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Abstract:

The interfacial reaction between pure tin and substrate with the composition of Cu-4.3 at% Ti (C1990HP) was investigated using the reaction couple technique from 240 °C until 270 °C in the range 0.5~4.0h. The SEM images show the Cu₆Sn₅ and small precipitated Ti₂Sn₃ phase formed at the Sn/C1990HP interface. In addition of Ti substantially increased the amount of intermetallic compound (IMC) at the interface which separated parts of Cu₆Sn₅ compounds with the inner region containing more Ti than the outer. The existence of Sn/C1990HP on the liquid/solid state reaction indicates that spalling occurred with changes in reaction time and temperature. With increased reaction temperature and time, the grain produced an abnormal condition resulting in Cu₆Sn₅ not accumulating at the interface and spalling into the solder in addition to grain ripening and an increase in total layer thickness. The hexagonal prism-shaped Cu₆Sn₅ phase is found on the top of the C1990HP substrate when the Cu₆Sn₅ layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed in this study.

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Seminar on Materials Science and Technology

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Periodical:

Materials Science Forum (Volume 964)

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263-269

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.964.263

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Online since:

July 2019

Authors:

Andromeda Dwi Laksono*, Jing Shiun Chang, Jessie Yan, Yee Wen Yen

Keywords:

Cu-Ti Alloy, IMC, Interfacial Reaction, Liquid/Solid State Reaction, Pure TiN

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© 2019 Trans Tech Publications Ltd. All Rights Reserved

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