Simulation Research on Double-Side Grinding Method with Variable Position Rotation

Abstract:

In this paper, a double-side grinding method with variable position rotation is proposed, which changes the motion mode of the workpiece in the fixed distance rotation grinding from the grinding principle, and realizes the irregular planar motion of the workpiece in the isolation dics at the same time as the rotation. That is, the movement trajectory of the workpiece rotation center relative to the grinding tool is the curve of the change. Different grinding principles fundamentally overcome some defects of traditional planar grinding methods. A prototype model of variable position rotation grinding is established, and the feasibility of the new method is verified by simulation experiments. The simulation data also further proves the time-varying nature of this grinding method in improving the grinding trajectory, the uniformity of relative velocity distribution of grinding and the superiority and diversity of the mechanical wear of the grinding mechanism and the ability to adjust the grinding trajectory.

• Periodical: Materials Science Forum (Volume 977)
• Pages: 148-156
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.977.148
• Online since: February 2020
• Authors: Wen Yan*, Yu Mei Huang, Wei Yi Mu
• Keywords: Plane Grinding, Time-Varying of Trajectory, Variable Position Rotation, Velocity Distribution

References

[1] J. D.Yang, C. L. Tian, and C. X. Wang. Nanometer lapping technology at high speed, Science in China. 50.1(2007) 27-38.

[2] J. S. Yang, X. L. Zhu, Research on Uniformity of Trajectory in Planetary Double-Side Lapping Process, Mechanical Research & Application. 6(2015) 41-43.

[3] Hsieh, Long Chang, and T.H. Chen. The systematic design of planetary-type grinding devices for optical fiber ferrules and wafers. Transactions of the Canadian Society for Mechanical Engineering 40 (2016) 41-43.

DOI: 10.1139/tcsme-2016-0049

[4] Heiji YASUI,Kanta YAMAGUCHI and Syoji KURIBAYASHI. Development of High Efficient Double Side Surface Polishing Machine Based on the New Concept. Japan Society for precision Engineering, 73(2007) 1325-1329.

DOI: 10.2493/jjspe.73.1325

[5] S. Li, Y. Q. Wang, Y.H. Zhang, and G. Y. Liu. The Dynamic Simulation of Vertical Planetary Wheel Sand Reclamation Equipment Based on ADAMS. Applied Mechanics and Materials 397-400(2013) 311-314.

DOI: 10.4028/www.scientific.net/amm.397-400.311

[6] Y.Y. Wu, P.J. Xue. Modeling and Movement Simulation of Planetary Pin Gear Lapping Machine Based on Solidworks and Adams. Journal of Zhongzhou University. 33.2(2016) 108-111.

[7] Q. M. Shi. Study on Multi-contacts with ADAMS. Computer Engineering and Applications. 29(2004) 220-222.

[8] F. J. P. Sousa, D. S. Hosse, I. Reichenbach, J. C. Aurich, and J. Seewig, Influence of kinematics and abrasive configuration on the grinding process of glass. Journal of Materials Processing Technology, 213.5(2013) 728-739.

DOI: 10.1016/j.jmatprotec.2012.11.026

[9] P. Zhao, L. Tao, Z. W. Wang, and J. L. Yuan. Review on Trace of Plane Lapping/polishing. Aviation Precision Manufacturing Technology. 45.2(2009) 1-6.

[10] L. M. Wang, X. M. Zhang, and J. F. Fan. Discussing on Solid Abrasive Lapping Path. Journal of Changchun University of Science and Technology. 3(1997) 15-19.

[11] H. J. Wu, L. X. Cao, J. Liu, and L. S. Guo. Analysis of path curves of face grinding process on lapping machines, Journal of Dalian University of Technology. 42.4(2007) 451-454.

[12] J. S. Pan, Q. S. Yan, X. P. Xu, J.T. Zhu, Z. C. Wu, and Z. W. Bai. Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing. Physics Procedia. 25(2012) 176-184.

DOI: 10.1016/j.phpro.2012.03.067