Image Wavelet Transform for PCB Soldering's Quality Evaluation

Abstract:

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An integration degree of modern printed circuit boards (PCB) is continually increasing. One of the important stages in the manufacturing of electronic devices is component soldering onto PCB pads. The soldering process is affected by many factors, which may lead to the formation of undesirable soldering defects. Some kinds of defects including bridge defects are detected visually. In the current article the possibility of bridge defect detection in a multi-pin surface mount component PCB images using wavelet transform is analyzed.

Info:

Periodical:

Solid State Phenomena (Volume 113)

Edited by:

Nin Bizys, Andrejus Henrikas Marcinkevicius

Pages:

85-90

DOI:

10.4028/www.scientific.net/SSP.113.85

Citation:

E. Zitkevicius and R. Martavicius, "Image Wavelet Transform for PCB Soldering's Quality Evaluation", Solid State Phenomena, Vol. 113, pp. 85-90, 2006

Online since:

June 2006

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Price:

$35.00

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