An integration degree of modern printed circuit boards (PCB) is continually increasing. One of the important stages in the manufacturing of electronic devices is component soldering onto PCB pads. The soldering process is affected by many factors, which may lead to the formation of undesirable soldering defects. Some kinds of defects including bridge defects are detected visually. In the current article the possibility of bridge defect detection in a multi-pin surface mount component PCB images using wavelet transform is analyzed.