Manufacturing and Plasma Electrolytic Oxide Coatings on the Thin-Wall Aluminum Notebook PC Case

Chang Seog Kang; Ik Hyun Oh; Jae Ik Cho; Jae Seol Lee; Hyeon Taek Son; Jung Chan Bae; Young Chan Kim; Sung Kil Hong

doi:10.4028/www.scientific.net/SSP.118.541

Paper Titles

Creep and High Temperature Fatigue Resistance of Ti-6Al-4V Modified by Duplex Plasma Carburization/CrN Coating
p.515

The Effect of Slip Conditions on the Contact Fatigue Strength for Pitting of a Carburized Steel
p.521

Effects of Heating Time, Electric Power and Frequency on Bending Fatigue Strength of Induction Hardened Gears
p.527

Improved Pore Array and Uniformity of Anodic Aluminum Oxide Template by Using a Rapid Thermal Anneal Process
p.535

Manufacturing and Plasma Electrolytic Oxide Coatings on the Thin-Wall Aluminum Notebook PC Case
p.541

Effects of Annealing Treatment of Aluminum Substrate on Nanopore Arrangements in Anodic Alumina
p.549

Phase Transitions in Binary SnO₂-CeO₂ System Prepared by a Sol-Gel Method
p.555

Effects of Annealing Treatment on Microstructure and Thermoelectric Properties of Ba₈Al₁₆Si₃₀
p.561

Annealing Effect on the Thermoelectric Properties of Undoped CoSb₃
p.565

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Manufacturing and Plasma Electrolytic Oxide Coatings on the Thin-Wall Aluminum Notebook PC Case

Abstract:

The silicon-based aluminum casting alloy and 2 different types of gate designs were used to investigate experimentally the fabrication feasibility of sound thin-wall case casting by diecasting process. While split type gate design had no defect, tangential type gate design resulted in cracks in the all obtained specimens. Electrolytic Oxide (PEO) coating was performed as a surface treatment process. Before the PEO coating treatments some die cast specimens were heat treated at the temperature of 323K and N2 atmosphere for 1hr to evaluate the effect of heat treatment. The result showed that hardness was improved after PEO coating, however, the effect of heat treatment was not significant.

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Periodical:

Solid State Phenomena (Volume 118)

Pages:

541-548

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.118.541

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Online since:

December 2006

Authors:

Chang Seog Kang, Ik Hyun Oh, Jae Ik Cho, Jae Seol Lee, Hyeon Taek Son, Jung Chan Bae, Young Chan Kim, Sung Kil Hong

Keywords:

AlSiCu Alloys, Die Casting, PEO, Solidification Simulation, Thin Wall Case

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