Photodefined Metal Pattern Formation and Its Electromagnetic Interference Shielding Effect

Eok Chae Hwang; Ho Chul Lee; Jin Young Kim; Sung Hen Cho; Chang Ho Noh; Ki Yong Song

doi:10.4028/www.scientific.net/SSP.119.199

Paper Titles

Consolidation and Mechanical Properties of Near-Net-Shape Al-21 wt.% Si Component Fabricated by Plasma Spray Forming
p.183

Preparation of Impurity-Doped TiO₂ Nanoparticles and Their Applications for Photocatalysis and Biopanning
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Microwave-Assisted Combustion Synthesis of α-Alumina and Magnesium Aluminate Spinel Nanocomposite Powders
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Characterization and Photocatalytic Properties of Transition Metal Doped TiO₂ and Nanocomposite TiO₂ Powders Synthesized by Mechanical Alloying
p.195

Photodefined Metal Pattern Formation and Its Electromagnetic Interference Shielding Effect
p.199

Preparation and Characterization of PP/Organoclay Nanocomposites with Maleic-Anhydride
p.203

Developing Carbon Nanocomposite Smart Materials
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A Study of Surface Modification on Adsorption Behaviors of Nanoporous Carbon
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Thermal and Mechanical Properties of Epoxy/Polyurethane Blend System Initiated by Cationic Latent Thermal Catalyst
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HomeSolid State PhenomenaSolid State Phenomena Vol. 119Photodefined Metal Pattern Formation and Its...

Photodefined Metal Pattern Formation and Its Electromagnetic Interference Shielding Effect

Abstract:

This paper proposes a electromagnetic interference (EMI) shielding effect of Cu mesh patterns which were formed by a novel, low-cost, photodefined metal pattern using a bilayer thin film of amorphous titanium dioxide (TiO2) and hole-scavenger-containing poly(vinyl alcohol) (PVA). Via UV-irradiation through a photomask on the bilayer film, the photodefined image of photoelectrons can be easily produced, resulting in selective palladium (Pd) catalyst deposition by reduction. In the bilayer thin film, the hole-scavenger-containing PVA layer scavenge the holes in the valence band of UV-irradiated TiO2 thin film, this retarding the recombination of the photoexcited electron-hole pairs for a few minutes. These long-surviving photoelectrons in the bilayer structure can reduce the Pd ions on only the photodefined region. Successive Ni electroless plating on Pd catalysts and Cu electroplating on an electroless plated pattern are possible. The electromagnetic interference shielding effects of selective nickel and copper mesh patterns were investigated.

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Solid State Phenomena (Volume 119)

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199-202

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.119.199

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Online since:

January 2007

Authors:

Eok Chae Hwang, Ho Chul Lee, Jin Young Kim, Sung Hen Cho, Chang Ho Noh, Ki Yong Song

Keywords:

Amorphous TiO₂, EMI, Mesh Pattern, Photoelectron, Selective Deposition, Shielding

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