Kinetic Monte Carlo Study of Void Distribution in Nickel Thin Film by Physical Vapor Deposition

Abstract:

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2D kinetic Monte Carlo simulation has been used to study the void distribution of nickel thin film prepared by physical vapor deposition, and embedded atom method (EAM) was used to represent the interatomic interaction. Packing density and surface roughness were studied as the functions of deposition rate, substrate temperature and incident angle. The results reveal the existence of critical substrate temperature and critical incident angle, and higher substrate temperature, lower deposition rate and appropriate incident angle are advantaged to prepare the compact thin film with excellent mechanical properties.

Info:

Periodical:

Solid State Phenomena (Volumes 121-123)

Edited by:

Chunli BAI, Sishen XIE, Xing ZHU

Pages:

1153-1156

DOI:

10.4028/www.scientific.net/SSP.121-123.1153

Citation:

X. D. He et al., "Kinetic Monte Carlo Study of Void Distribution in Nickel Thin Film by Physical Vapor Deposition", Solid State Phenomena, Vols. 121-123, pp. 1153-1156, 2007

Online since:

March 2007

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Price:

$35.00

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