Kinetic Monte Carlo Study of Void Distribution in Nickel Thin Film by Physical Vapor Deposition

Xiao Dong He; Ying Chun Shan; Ming Wei Li

doi:10.4028/www.scientific.net/SSP.121-123.1153

Paper Titles

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Kinetic Monte Carlo Simulation of Nucleation and Growth Behavior in Surfactant-Mediated Epitaxy
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Kinetic Monte Carlo Study of Void Distribution in Nickel Thin Film by Physical Vapor Deposition
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Molecular Dynamics Simulation for Compressive Mechanics Properties of SWCNT with Random Distributed Vacancies
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Simulation of 3D Layer-By-Layer Photonic Crystals
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Stiffness Prediction of Nano-Fibers Composite Ceramics
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Kinetic Monte Carlo Study of Void Distribution in Nickel Thin Film by Physical Vapor Deposition

Abstract:

2D kinetic Monte Carlo simulation has been used to study the void distribution of nickel thin film prepared by physical vapor deposition, and embedded atom method (EAM) was used to represent the interatomic interaction. Packing density and surface roughness were studied as the functions of deposition rate, substrate temperature and incident angle. The results reveal the existence of critical substrate temperature and critical incident angle, and higher substrate temperature, lower deposition rate and appropriate incident angle are advantaged to prepare the compact thin film with excellent mechanical properties.