Palladium and Platinum Deposition onto 4-Mercaptopyridine SAMs

Abstract:

A novel technique has recently been presented for depositing metal layers onto a SAM. This is demonstrated here for Pd and Pt deposits on a mercaptopyridine (4-PyS) SAM. The SAMcovered Au(111) electrode is immersed into the metal-ion-containing solution without potential control. As a result, metal ions, e.g., Pd(II) (respectively Pt(II)) adsorb on the surface by forming a complex with the pyridine species. Subsequently, the electrode is transferred to a metal-ion-free solution, where the adsorbed metal ions are reduced electrochemically to its zero-valent state. Upon reduction, monoatomic high metal islands were observed in STM. Angle resolved XPS measurements show unequivocally that the reduced metal resides on top of the SAM.

• Periodical: Solid State Phenomena (Volumes 121-123)
• Pages: 363-368
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.121-123.363
• Online since: March 2007
• Authors: Valentina Ivanova, Mila Manolova, Dieter M. Kolb
• Keywords: Cyclic Voltametry (CV), Gold, Mercaptopyridine, Metal Deposition, Palladium, Platinum, Self-Assembled Monolayer (SAM), STM

References

[1] M. Nishizawa, T. Sunagawa, H. Yoneyama, Langmuir 13 (1997) 5215.

[2] H. Hagenström, M. A. Schneeweiß, D. M. Kolb, Langmuir 15 (1999) 7802.

[3] S. E. Gilbert, O. Cavalleri, K. Kern, J. Phys. Chem. 100 (1996) 12123.

[4] F. P. Zamborini, J. K. Campbell, R. M. Crooks, Langmuir 14 (1998) 640.

[5] D. Oyamatsu, S. Kuwabata, H. Yoneyama, J. Electroanal. Chem. 473 (1999) 59.

[6] O. Cavalleri, A. Bittner, K. Kern, T. Greber, Z. Phys. Chem. 208 (1999) 107.

[7] L. Sun, R. M. Crooks, J. Electrochem. Soc. 138 (1991) L23.

[8] H. Hagenström, M. A. Schneeweiß, D. M. Kolb, Electrochim. Acta 45 (1999) 1141.

[9] M. A. Schneeweiß, H. Hagenström, M. J. Esplandiu, D. M. Kolb, Appl. Phys. A 69 (1999) 537.

[10] M. J. Esplandiu, H. Hagenström, D. M. Kolb, Langmuir 17 (2001) 828.

[11] M. J. Esplandiu, Probe Microscopy 2 (2001) 89.

[12] T. Baunach, D. M. Kolb, Anal. Bioanal. Chem. 373 (2002) 743.

[13] D. R. Jung, A. W. Czandena, G. C. Herdt, J. Vac. Sci. Technol. A 14 (1996) 1779.

[14] G. C. Herdt, A. W. Czandena, J. Vac. Sci. Technol. A 17 (1999) 3415.

[15] D. R. Jung, A. W. Czanderna, Crit. Rev. Solid State Mater. Sci. 19 (1994) 1.

[16] E. L. Smith, A. A. Alves, J. W. Anderegg, M. D. Porter, L. M. Siperko, Langmuir 8 (1992) 2707.

[17] M. Schlesinger, M. Paunovic: Modern electroplating (Wiley, 2000).

[18] H. Kind, A. M. Bittner, O. Cavalleri, K. Kern, Th. Greber, J. Phys. Chem. B 102.

[19] C. D. Zangmeister, R. D. van Zee, Langmuir 19 (2003) 8065.

[20] W. P. Zhou, T. Baunach, V. Ivanova, D. M. Kolb, Langmuir 20 (2004) 4590.

[21] T. Baunach, V. Ivanova, D. A. Scherson, D. M. Kolb, Langmuir 20 (2004) 2797.

[22] T. Baunach, V. Ivanova, D.M. Kolb, H. -G. Boyen, P. Ziemann, M. Büttner, P. Oelhafen, Adv. Mater. 16 (2004) (2024).

DOI: 10.1002/adma.200400409

[23] M. Manolova, V. Ivanova, D.M. Kolb, H. -G. Boyen, P. Ziemann, M. Büttner, A. Romanyuk, and P. Oelhafen, Surf. Sci., accepted.

[24] V. Ivanova, T. Baunach, D.M. Kolb, Electrochim. Acta, in press.