Texture and Microstructure in Ni-W Alloy Tape Manufactured by the Powder Metallurgy Process

Sang Suk Kim; Sung Yeal Bae; In Sup Ahn; Cheol Jin Kim; Ki Won Kim; Kwon Koo Cho

doi:10.4028/www.scientific.net/SSP.124-126.1493

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HomeSolid State PhenomenaSolid State Phenomena Vols. 124-126Texture and Microstructure in Ni-W Alloy Tape...

Texture and Microstructure in Ni-W Alloy Tape Manufactured by the Powder Metallurgy Process

Abstract:

Ni-3at.%W alloy tapes for YBCO coated conductor were fabricated by powder metallurgy process including powder compaction, cold isostatic pressing(CIP), cold rolling and annealing for recrystallization. The Ni-3at.%W tapes annealed in an atmosphere of 96%Ar and 4%H2 mixing gas were characterized by X-ray pole figures, orientation distribution function(ODF) and optical microscopy(OM). The Ni-W alloy tapes were heat-treated at 700~1000°C for the development of cube texture {001}<100>. The texture analysis indicated that as fabricated tapes have a sharp cube texture after annealing at 900 and 1000°C. Also, thoroughly recrystallization takes place for the annealed tapes at the both temperatures and the average grain size of the two tapes is about the same, which is about 35㎛.

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Periodical:

Solid State Phenomena (Volumes 124-126)

Pages:

1493-1496

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.124-126.1493

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Online since:

June 2007

Authors:

Sang Suk Kim, Sung Yeal Bae, In Sup Ahn, Cheol Jin Kim, Ki Won Kim, Kwon Koo Cho

Keywords:

Cube Texture, Ni Tape, Powder Metallurgy (PM)

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