Advances in Nanomaterials and Processing

Volumes 124-126

doi: 10.4028/

Paper Title Page

Authors: Seong Min Lee

Abstract: This study examines how the increased density of passivated metallic conductor lines caused by large circuit integration in semiconductor...

Authors: Ja Myeong Koo, Dea Gon Kim, Seung Boo Jung

Abstract: The interfacial reactions and shear properties of Sn-37Pb (wt.%) solder bumps with two different under bump metallizations (UBMs), Cu and...

Authors: Min Seung Yoon, Oh Han Kim, Young Chang Joo, Young Bae Park

Abstract: In-situ observation by scanning electron microscope of the microstructure evolution near the cathode depletion region and the quantitative...

Authors: Chong Mu Lee, Keun Bin Yim, Anna Park, Ho Jin Kim

Abstract: The structure and electrical properties of ZrO2 dielectric thin films deposited by rf magnetron sputtering were investigated. The fixed...

Authors: Seung Woo Han, Kyoung Wan Park, Jung Hyun Sok

Abstract: Resistance-switching behaviors of the Pr0.7Ca0.3MnO3(PCMO) films based metalinsulator- metal (MIM) devices has been investigated. In this...

Authors: Myoung Sub Kim, Jin Hyung Jun, Jin Ho Oh, Hyeong Joon Kim, Jae Sung Roh, Suk Kyoung Hong, Doo Jin Choi

Abstract: Ge2Sb2Te5 (GST) has been widely studied for PRAM as reversible phase change material. GST is expected to reduce RESET (crystalline →...

Authors: Boo Yang Jung, Eun Kyoung Choi, Young Soo Jeon, Kwang Yong Lee, Kwang Seok Seo, Tae Sung Oh

Abstract: For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were...

Authors: Nam Hoon Kim, Hae Young Yoo, Eui Goo Chang

Abstract: The ambient and denuded trench top corner at the step of gate oxidation play an important role to generate defect. Furthermore,...


Showing 1 to 10 of 461 Paper Titles