Bump Formation and Flip Chip Processes for RF System-on-Packages

Abstract:

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For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sn solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sn solder joints was about 13m/ which was much lower than 24~33m/ of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park

Pages:

25-28

DOI:

10.4028/www.scientific.net/SSP.124-126.25

Citation:

B. Y. Jung et al., "Bump Formation and Flip Chip Processes for RF System-on-Packages", Solid State Phenomena, Vols. 124-126, pp. 25-28, 2007

Online since:

June 2007

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Price:

$38.00

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DOI: 10.1109/icept.2005.1564608

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