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Preface
Dependence of Thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices
p.1
Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test
p.5
Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines
p.9
Electrical Properties of ZrO2 Capacitor Dielectrics Deposited by rf Magnetron Sputtering
p.13
Role of SrRuO3 Buffer Layers in Enhancing Resistance Changing of Pr0.7Ca0.3MnO3 Films
p.17
Electrical Switching Characteristics of Nitrogen Doped Ge2Sb2Te5 Based Phase Change Random Access Memory Cell
p.21
Bump Formation and Flip Chip Processes for RF System-on-Packages
p.25

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Solid State Phenomena (Volumes 124-126)

Online since:

June 2007

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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