The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining

Min Ku Lee; Jung G. Lee; Jong Keuk Lee; Jin Ju Park; Young Rang Uhm; Chang Kyu Rhee

doi:10.4028/www.scientific.net/SSP.135.135

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The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining

Abstract:

In this study, joining characteristics of dissimilar Ti and Cu metals have been investigated, when using both an Ag-based eutectic alloy as a filler and an Ag layer present on Ti base metal as a diffusion barrier. The observed microstructures were classified into three characteristic types, depending on the presence of a Ag layer at the Ti interface, e.g. first, the sample retaining thick continuous intermetallic layers, e.g. Ti2Cu, TiCu, Ti3Cu4, Ti2Cu3, and TiCu4 by a significant dissolution of the Ti atoms into the molten filler, in the absence of a Ag coating layer onto the Ti base metal, second, the sample with relatively thin Ti-Cu intermetallic layers by the reduced reaction of Ti with Cu due to a prominent decrease in the Ti dissolution, owing to the role of the Ag coating layer as a diffusion barrier, and finally, the sample without any brittle Ti-Cu intermetallics in the joint by a complete suppression of both the dissolution of the Ti atoms and its reaction with the Cu elements in the molten filler due to the presence of a Ag layer.

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Solid State Phenomena (Volume 135)

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135-138

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.135.135

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Online since:

February 2008

Authors:

Min Ku Lee, Jung G. Lee, Jong Keuk Lee, Jin Ju Park, Young Rang Uhm, Chang Kyu Rhee

Keywords:

Ag Diffusion barrier, Dissimilar Joining, Ti brazing, Ti-Cu Intermetallics

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