Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni

Abstract:

Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth upon annealing and where twinning was found to be responsible for the texture development.

• Periodical: Solid State Phenomena (Volume 160)
• Pages: 235-240
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.160.235
• Online since: February 2010
• Authors: Uta Klement, L. Hollang, S.R. Dey, M. Battabyal, O.V. Mishin, Werner Skrotzki
• Keywords: Electro-Deposition, Electron Backscatter Diffraction (EBSD), In Situ TEM, Nickel, Texture Development, Thermal Stability

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