Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni

Abstract:

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Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth upon annealing and where twinning was found to be responsible for the texture development.

Info:

Periodical:

Solid State Phenomena (Volume 160)

Edited by:

H. Klein and R.A. Schwarzer

Pages:

235-240

DOI:

10.4028/www.scientific.net/SSP.160.235

Citation:

U. Klement et al., "Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni", Solid State Phenomena, Vol. 160, pp. 235-240, 2010

Online since:

February 2010

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Price:

$35.00

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