Development Evaluation of Mechanical Properties of Brazed Diamond Wire

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Abstract:

Fixed-abrasive wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional fixed-abrasive wire saw such as significant low holding abrasive ability, low machining efficiency, high running costs, etc. A new fixed-abrasive wire, namely brazed diamond wires have been developed to overcome these problems. In this paper, brazed diamond wire were carried out to braze two different size diamond grits onto two different thin steel wires by using a nickel-based powder as brazing alloy. The mechanical properties of brazed diamond wire were evaluated by tensile and breaking twist experiment. The experimental results showed that the heating in the brazing process has litter influence on the wire mechanical properties. The addition of brazed alloy and diamond grits sharply decreased the wire mechanical properties significantly, both in the tensile strength and breaking twist angle. Bigger diamond grit would make the accumulation of brazed alloy which leaded to the deterioration of diameter consistency of wires.

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Periodical:

Solid State Phenomena (Volume 175)

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294-299

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June 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] H.K. Tönshoff, W. V. Schmieden, I. Inasaki, W. König, G. Spur: Annals of the CIRP, Vol. 39(2), 1990: pp.621-635.

DOI: 10.1016/s0007-8506(07)62999-0

Google Scholar

[2] M. Fujisawa, T. Oku, N. Arakawa and M. Watanabe: Annals of the CIRP, Vol. 32 (1), 1983: pp.87-90.

DOI: 10.1016/s0007-8506(07)63367-8

Google Scholar

[3] J. Sugawara, H. Hara and A. Mizoguchi: SEI Technical Review, Vol. 58, 2004: pp.7-11.

Google Scholar

[4] W.H. Craig, Q. Jun and J.S. Albert: Proceedings of IMECE 2003, ASME International Mechanical Engineering Congress Washington, D.C. November 15-21, 2003: pp.1-8.

Google Scholar

[5] G.Q. Zhang, H. Huang and X.P. Xu: Key Engineering Materials Vol. 443, 2010: pp.537-542.

Google Scholar

[6] E. Toshiyuki, S. Yutaka, T. Yasuhiro, S. Mari and K. Yuichi: Annals of the CIRP, Vol. 48(1), 1999: pp.273-276.

Google Scholar

[7] B. Wang, B. Xiao, S. Li: Machine Building & Automation, Vol. 39(4), 2010: pp.27-29 (Chinese).

Google Scholar