A Mathematical Modeling Method for Capillary Limit of Micro Heat Pipe with Sintered Wick

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Abstract:

With heat flux increasing and cooling space decreasing in microelectronic and chemical products, micro heat pipe has become an ideal heat dissipation device in high heat-flux products. Through the analysis of its working principle, the factors that affect its heat transfer limits and the patterns in which copper powders are arrayed in circular cavity, this paper first established a mathematical model for the crucial factors in affecting heat transfer limits in a circular micro heat pipe with a sintered wick, i.e. a theoretical model for capillary limit, and then verified its validity through experimental investigations. The study lays a powerful theoretical foundation for designing and manufacturing circular micro heat pipes with sintered wicks.

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Solid State Phenomena (Volume 175)

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335-341

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June 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] D.K. Chen: Chinese Journal of Low Temperature Physics. Vol. 8 (2005), pp.255-262.

Google Scholar

[2] Z.T. Gu: Reliability Theory and Practice of Computer (University of Electronic Science and Technology Press, Chengdu 1994).

Google Scholar

[3] L.L. Vasiliev: Applied Thermal Engineering. Vol. 8 (2006), pp.105-113.

Google Scholar

[4] J. Zhuang Jun, H. Zhang: Heat Pipe Technology and Engineering Application (Chemical Industry Press, Beijing 2000).

Google Scholar

[5] S.J. Kim, J.K. Seo, K.H. Do: Int. J. Heat Mass Transfer. Vol. 46(2003), p.2051-(2063).

Google Scholar

[6] S. Launay: Int. J. Thermal Sciences. Vol. 43(2004), pp.499-507.

Google Scholar

[7] V. Sartre, M.C. Zaghdoudi, M. Lallemand: Int. J. Thermal Sciences. Vol. 39(2000), pp.498-504.

Google Scholar

[8] S. Launay, V. Sartre: Applied Thermal Engineering. Vol. 24(2004), pp.233-243.

Google Scholar

[9] S.W. Kang, S.H. Tsai, H.C. Chen: Applied Thermal Engineering. Vol. 22(2002), pp.1559-1568.

Google Scholar

[10] M.E. Rojas, M.C. Andres: Int. J. Multiphase Flow. Vol. 32(2006), pp.517-526.

Google Scholar

[11] R.H. Nilson, S.W. Tchikanda, S.K. Griffiths: Int. J. Heat Mass Transfer. Vol. 49(2006), pp.1603-1618.

Google Scholar

[12] Y. Chi: Ph. D Thesis (South China University of Technology, Guangzhou 2007).

Google Scholar

[13] Y. Li: Ph. D Thesis (South China University of Technology, Guangzhou 2008).

Google Scholar

[14] X.B. Li: Ph. D Thesis (South China University of Technology, Guangzhou 2009).

Google Scholar

[15] L.S. Lu: Ph. D Thesis (South China University of Technology, Guangzhou 2009).

Google Scholar

[16] C.L. Tien, K.H. Jun: ASME J. Heat Mass Transfer. 14(1971), p.1853.

Google Scholar

[17] A. Acton: Proc. 4th Int. Heat Pipe Conf. 1981, p.279.

Google Scholar

[18] T.K. Ferrell, J. Alleavitch: Preprint No. 6, ASME-AICHE Heat Transfer Conf. Minneapolis, Minn. August, (1969).

Google Scholar

[19] R. G, Bressler, P. W. Wyatt: ASME J. Heat Transfer. (1970), pp.126-132.

Google Scholar

[20] S.W. Chi: Heat Pipe Theory and Practice (McGrow Hill, 1976).

Google Scholar

[21] J.H. Cosgrove: Ph. D Thesis (North Carolina State Univ, 1966).

Google Scholar