A Study of Ti-Ta Library and Microstructure Manufactured by Magnetron Sputtering

Sergiu Barbos; Andrei Novac; Roxana Sprincenatu; Madalin Condel; Ion Mitelea; Corneliu Craciunescu

doi:10.4028/www.scientific.net/SSP.254.97

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HomeSolid State PhenomenaSolid State Phenomena Vol. 254A Study of Ti-Ta Library and Microstructure...

A Study of Ti-Ta Library and Microstructure Manufactured by Magnetron Sputtering

Abstract:

Ti-Ta films were deposited out of Ti and Ta targets on glass and kapton substrates. The co-deposition leaded to the formation of a compositional spread in the Ti-Ta system, a continuous variation of the Ta/Ti ratio along the full range of the film. The typical microstructure observed for the films deposited at RT consisted of columnar grains with dotted Ta-rich particles, reflecting a relatively nonhomogenous structure. Annealing at 400 °C leaded to the individualization of grain boundaries and to a coalescence of the Ta-rich particles. Annealing at 500 °C further reduced the amount of particles, but also appeared to be associated with the cracking in the stressed area of the film/kapton structure.

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Periodical:

Solid State Phenomena (Volume 254)

Pages:

97-101

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.254.97

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Online since:

August 2016

Authors:

Sergiu Barbos, Andrei Novac, Roxana Sprincenatu, Madalin Condel, Ion Mitelea, Corneliu Craciunescu*

Keywords:

Compositional Spread, Magnetron Sputtering, Thin Film, Ti-Ta Alloy System

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References

[1] Po-Yen Hsu, Jyh-Ming Ting- Growth and characteristics of TiNiCu thin films, Thin solid Films, 420-421 (2002) 524-529.

DOI: 10.1016/s0040-6090(02)00936-7

Google Scholar

[2] Y.Q. Fu, H.J. Du - Effects of film composition and annealing on residual stress evolution for shape memory TiNi film, Mater. Sci. Eng. A 342 (2003) 236–244.

DOI: 10.1016/s0921-5093(02)00285-x

Google Scholar

[3] C.M. Craciunescu, J. Li, M. Wuttig, Thermoelastic Stress-Induced Thin Film Martensites, Scripta Materialia, vol 48/1 (2003), 65-70.

DOI: 10.1016/s1359-6462(02)00347-0

Google Scholar

[4] C.M. Crăciunescu, J. Li si M. Wuttig – Constrained Martensitic Transformations in TiNiCu Films, Thin Solid Films 434 (2003) 271-275.

DOI: 10.1016/s0040-6090(03)00531-5

Google Scholar

[5] C. Craciunescu, A. Ercuta, Prediction of Thermally-Controlled Actuation for Shape Memory Alloy Film-Based Bimorph Cantilevers, Smart Materials and Structures, Volume: 23, Issue: 7, (2014).

DOI: 10.1088/0964-1726/23/7/075025

Google Scholar

[6] P. J. S. Buenconsejo, H. Y. Kim, H. Hosoda, S. Miyazaki, Acta Materialia 2009, 57, 1068.

Google Scholar

[7] J. Ma, I. Karaman, R. D. Noebe, International Materials Reviews 2010, 55, 257.

Google Scholar

[8] C.M. Wayman and T.W. Duerig, in Engineering Aspects of Shape Memory Alloys, ed., Butterworth-Heinemann, Boston, 1990. p.3.

Google Scholar

[9] Y. Motemani, P. J. Buenconsejo, C. Craciunescu, and A. Ludwig, High-Temperature Shape Memory Effect in Ti-Ta Thin Films Sputter Deposited at Room Temperature, Advanced Materials Interfaces Volume 1, Issue 3, June, (2014).

DOI: 10.1002/admi.201400019

Google Scholar

[10] Y. Fu, H. Du, S. Zhang - Adhesion and interfacial structure of magnetron sputtered TiNi films on Si/SiO2 substrate, Thin Solid Films 444 (2003) 85-90.

DOI: 10.1016/s0040-6090(03)01029-0

Google Scholar