Multi-Parameter Based Stress Distribution in Vicinity of Sharp Material Inclusion Tip

Abstract:

General Singular Stress Concentrators (GSSCs) which exhibit singular stress concentration are often responsible for crack initiation and thus failure of the component. The GSSC of the type of bonded bi-material junction occurs in a variety of technical applications including but not limited to sharp material inclusions, silicate based composites and electronic components. The GSSC cannot be assessed by means of standard fracture mechanics. Approaches of generalized fracture mechanics require precise description of stress distribution near the stress concentration points. In order to determine the stress field accurately, the paper incorporates the multi-parameter based description.

• Periodical: Solid State Phenomena (Volume 258)
• Pages: 169-173
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.258.169
• Online since: December 2016
• Authors: Ondřej Krepl, Jan Klusák*
• Keywords: Bi-Material Junction, General Singular Stress Concentrator, Generalized Fracture Mechanics, Muskhelishvili Plane Elasticity, Sharp Material Inclusion

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