Influence of Particle Attributes on Residual Stresses in Particulate Ceramic Composites

Kateřina Štegnerová; Luboš Náhlík; Raúl Bermejo; Pavel Hutař

doi:10.4028/www.scientific.net/SSP.258.190

Paper Titles

The Effect of Residual Stress on the Process of Crack Growth Rate Determination in Polymer Pipes
p.174

Study of Influence of Residual Stresses on Crack Propagation in Particulate Ceramic Composites
p.178

Analysis of Micro-Cracks Using Modified Couple-Stress Elasticity under Anti-Plane Deformation
p.182

Prediction of the Traction Separation Law of Ceramics Using Iterative Finite Element Modelling
p.186

Influence of Particle Attributes on Residual Stresses in Particulate Ceramic Composites
p.190

Model of the Damaged Medium for the Assessment of Resource Characteristics of Structural Alloys for Degradation Mechanisms that Combine Fatigue and Creep of Material
p.194

Modeling of Deformation and Failure of Heat-Resistant Alloys under Cyclic Thermal-Mechanical Loading
p.198

Polarizable Models in Molecular Dynamics
p.202

Complete Williams Asymptotic Expansion near the Crack Tips of Collinear Cracks of Equal Lengths in an Infinite Plane
p.209

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Influence of Particle Attributes on Residual Stresses in Particulate Ceramic Composites

Abstract:

The contribution deals with the issue of residual stresses in particulate ceramic composites used in microelectronics. Residual stresses are developed in the composite due to cooling during manufacturing process. Different coefficients of thermal expansions of particles and matrix cause important residual stresses in the composite influencing their mechanical behaviour. The main aim of the paper is to determine influence of particle properties on magnitude and distribution of residual stresses in the composite matrix. Three dimensional numerical model was developed and finite element method (FEM) was used for numerical simulations. Results obtained contribute to a better understanding of residual stresses distribution and fracture processes in the studied type of composite.

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Periodical:

Solid State Phenomena (Volume 258)

Pages:

190-193

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.258.190

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Online since:

December 2016

Authors:

Kateřina Štegnerová*, Luboš Náhlík, Raúl Bermejo, Pavel Hutař

Keywords:

Ceramics for Microelectronics, Finite Element Method, Particulate Ceramic Composite, Residual Stresses

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