Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining

Azman Jalar; Maria Abu Bakar; Mohd. Zulhakimi Ab. Razak; Norliza Ismail

doi:10.4028/www.scientific.net/SSP.307.26

Paper Titles

Investigation of Nano-Sized Al₂O₃ on Pr-Sr-Mn-O Composites: Structural, Microstructural and Magnetic Properties
p.3

Structural, Magnetic and Magnetotransport Properties of Sol-Gel Synthesized La_0.67Ca_0.33MnO₃:TiO₂ Nanocomposite
p.9

Solderability of Coloured Lead Free Solder Composite
p.15

A Study of Multiferroic BiFeO₃/Epoxy Resin Composite as Potential Coating Materials for Microwave Absorption
p.20

Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining
p.26

Effect of Blast Wave on Intermetallics Formation, Hardness and Reduced Modulus Properties of Solder Joints
p.31

The Effect of Various ZnO Layer towards Sensing Performance as an Electrolyte-Insulator-Semiconductor pH Sensor
p.37

The Study of a Structural and Electronic Properties of Two-Dimensional Flat Layer Arsenene Using Planewaves Density Functional Calculation
p.45

Zinc Oxide Thin Film Synthesized by Sol-Gel Method
p.51

HomeSolid State PhenomenaSolid State Phenomena Vol. 307Morphological Effect on the Intermetallic Compound...

Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining

Abstract:

Evaluating the growth kinetics is one of the most important characteristic in assessing the quality and reliability of metallurgical joining, especially in electronics packaging such as soldering and wire bonding technology. The growth kinetics is normally assessed using Arrhenius equation that involves diffusion activities due to thermally activated process. The well-known factors of thermal and time together with generally accepted growth exponent have been widely used for this assessment. The intermetallic compound layer which is the by-product of metallurgical reaction during soldering process has been exposed to high temperature to accelerate its growth. The cross-section of the joining was observed using optical microscope to quantify the layer of intermetallic compound. Morphological effect and shape factor of the layer have been analysed in complement with the effect of temperature and time on the growth behaviour. Directional growth and irregularities shape of the intermetallic layer show some inconsistency on the selection of growth exponent. The effect of initial size of intermetallic layer must also be considered in this assessment. This study suggests that the morphological effect must be analysed prior to the selection the growth exponent in assessing growth behaviour and kinetics of intermetallic layer in metallurgical joining.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Solid State Phenomena (Volume 307)

Pages:

26-30

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.307.26

Citation:

Cite this paper

Online since:

July 2020

Authors:

Azman Jalar*, Maria Abu Bakar, Mohd. Zulhakimi Ab. Razak, Norliza Ismail

Keywords:

Electronics Packaging, Growth Exponent, Growth Kinetics, Intermetallic Compound Layer, Metallurgical Joining

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] S. Ishikawa, E.Hashino, T. Kono, K. Tatsumi, IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging, Mater. Trans. 46(11)(2005) 2351-2358.

DOI: 10.2320/matertrans.46.2351

Google Scholar

[2] A.K. Gain, Y.C. Chan, The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads, Intermetallics 29 (2012) 48-55.

DOI: 10.1016/j.intermet.2012.04.019

Google Scholar

[3] J. Kim, W.R. Myung, S.B. Jung, Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB, J. Elec. Mater. 45(11) (2016) 5895-5903.

DOI: 10.1007/s11664-016-4803-z

Google Scholar

[4] Z.J. Yang, S.M. Yang, H.S. Yu, S.J. Kang, J.H. Song, K.J. Kim, IMC and creep behavior in lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method. International Journal of Automotive Technology, 14(7) (2014) 1137-1142.

DOI: 10.1007/s12239-014-0118-3

Google Scholar

[5] M.A. Bakar, A. Jalar, R. Ismail, Reassessment of Stereometric Quantitative Measurements on the Growth of Intermetallic Compound for Solder Connections, Sains. Malays. 47(4)(2018)805-810.

Google Scholar

[6] A. Jalar, M.A. Bakar, R. Ismail, A.R. Daud, Statistical aspect on the measuring of intermetallic compound thickness of lead free solders, J. Sci. Res. Dev 3(4) (2016) 49-54.

Google Scholar

[7] Z.L. Li, L.X. Cheng, G.Y. Li, J.H. Huang, Y. Tang, Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints, J. Alloys Cmpd. 697 (2017) 104-113.

DOI: 10.1016/j.jallcom.2016.12.131

Google Scholar

[8] G. Zeng, S.D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. Gu, M.A.A. Mohd Salleh, K. Nogita, The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints, J. Alloys Cmpd. 685 (2016) 471-482.

DOI: 10.1016/j.jallcom.2016.05.263

Google Scholar

[9] J.E. Burke, D. Turnbull, Recrystallization and grain growth, Progress in Metal Physics 3(1952) 220-244.

DOI: 10.1016/0502-8205(52)90009-9

Google Scholar

[10] J. Shen, M. Zhao, P. He, Y. Pu, Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging, J. Alloys Cmpd. 574 (2013) 451–458.

DOI: 10.1016/j.jallcom.2013.05.156

Google Scholar