Development of High Strength and High Thermal Conductivity Semi-Solid Magnesium Alloy by Thixomolding Process

Abstract:

This paper investigates the influence of Cu addition on the microstructure, mechanical properties, and thermal conductivity of a semi-solid Mg-10Zn alloy produced by Thixomolding process. Microstructure of the Mg-10Zn alloy consists of α-Mg matrix and Mg₂Zn second phase. The formation of Cu₃Zn phase was found after the addition of Cu particles. Besides, the volume fraction of solid phase decreased in the Mg-Zn/Cu alloy compared with that of binary Mg-Zn alloy. The yield strength of the alloy was enhanced from 157MPa to 188MPa after Cu addition at the sacrifice of a small amount of ductility. Thermal conductivity, on the other hand, were kept the same level of 115-117 (W/m·K) in the Mg-10Zn alloy and Mg-10Zn/Cu alloy. This work demonstrates the potential for developing Mg alloys with high strength and high thermal conductivity via proper alloy design using Thixomolding process.

• Periodical: Solid State Phenomena (Volume 347)
• Pages: 97-106
• DOI: https://doi.org/10.4028/p-fTZBz0
• Online since: August 2023
• Authors: Li Dong Gu, Xiao Qing Shang, Jie Wang, Jun Jun Deng, Yu Peng Liu, Xiao Qin Zeng*, Wen Jiang Ding
• Keywords: Mechanical Properties, Semi-Solid Magnesium Alloy, Thermal Conductivity, Thixomolding

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