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[5] Zhang Xue-zhen,Li Xiao,Luo Da-wen,et al.A New authentication scheme based on Computer Science and Software Engineering.Wuhan,China:IEEE Computer Society,2008:1028-1030
[7] Tian Y L,Peng C G,Zhang R P,et al.A practical publicly verifiable secret sharing scheme based on bilinear.2nd International Conference on Anti-counterfeiting,Security and Identification, 2008(ASID2008)//Guiyang,China:IEEE,2008:71-75
[11] Wong TM, Wang CX, Wing JM.

Wong, P.E.
Vol. 450 (2008), p. 323
Vol. 59 (2008), p. 360
Vol. 68 (2008), p. 486

Wang, Nature Vol.451 (2008) , P.809
Gehring, Physical review letters Vol.100 (2008), P.47206
[21] C.Jagadish and S. pearton: Zinc Oxide Bulk, Thin Films and Nanostrctures(Elsevier publication, UK and 2008)
Wong, A.

Effect of Gel-Calcination on Piezoelectric Property in (1-x)BiScO3-xPbTiO3 Ferroelectrics Han Wang1, 2, a, Xiaohui Wang1, b, Shaopeng Zhang1, Longtu Li1 and Zhaohui Huang2 1 State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China 2 Department of Materials Science & Engineering, China University of Geosciences (Beijing), Beijing 100083, China a hanah_wong@163.com, b wxh@tsinghua.edu.cn Keywords: Gel-Calcination; BSPT; Piezoelectric; Grain size effect Abstract.
Wang, et al.: Applied Physics Letters Vol. 93(2008), 192913 [2] R.
With: Journal of The European Ceramic Society Vol. 28(2008), p.851 [5] X.H.
Soc Vol. 91[1] (2008), p.121 Fig. 6 (a), (b).

(April 2008), p. 20. 3.
De Bievre: Metrologia. 45 (2008), p. 335. 5.
Eren, Chun Che Fung, in: Electrical Engineering, edited by Wong Kit Po, in Encyclopedia of Life Support Systems (EOLSS), developed under the Auspices of the UNESCO (EOLSS Publishers, Oxford ,UK 2006), information on http://www.eolss.net 7.
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Sapozhnikova, in: Proceedings of the 12th IMEKO TC1 - TC 7 Joint Symposium, Annecy, France (September 2008), p. 212, information on http://www.imeko.org

In: Automatic Face & Gesture Recognition, Amsterdam, The Netherlands, 2008: 1 – 6 [5] T.F.Cootes, C.J.Taylor, D.Cooper,GKC.
Wong, F.Y.
Teoh, A new scheme for automated 3D PDM construction using deformable models, Image and Vision Computing 26(2) (2008) 275–288
Pattern Recognition, 41(3):833-851(2008) [21] Y.
Maechler: Matrix: A Matrix package for R (2008). cran.r-project.org/web/packages/Matrix/index.html.

Nanotechnology(2008), 19: 1-15
Ed(2008), 47: 6550-6570
Wong, W.
Diamond & Related Materials(2008), 17: 1586-1589
Actuators B: Chem(2008), 134: 1022-1026.

Gutmann and L.Rafael Reif Wafer level 3D ICs process technology, 2008, pp.1-18 [2] Lim, D.F.; Wei, J.; Leong, K.C.; Tan, C.S.; , "Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking," Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International , vol., no., pp.1-3, 8-12 May 2011 [3] Peng, L.; Li, H.Y.; Lim, D.F.; Gao, S.; Tan, C.S.; , "Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking," Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st , vol., no., pp.22-26, May 31 2011-June 3 2011 [4] Ang, X.F.; Lin, A.T.; Wei, J.; Chen, Z.; Wong, C.C.; , "Low Temperature Copper-Copper Thermocompression Bonding," Electronics Packaging Technology Conference, 2008.
EPTC 2008. 10th , vol., no., pp.399-404, 9-12 Dec. 2008 [5] Akitsu Shigetou, Toshihiro Itoh, Mie Matsuo, Nobuo Hayasaka, Katsuya Okumura and Tadatomo Suga “Bumpless interconnect through ultrafine Cu electrodes by means of Surface-Activated Bonding(SAB) method” IEEE transactions on advanced packaging,vol.29, 2006 [6] Dau Fatt Lim; Singh, S.G.; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan; , "Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC," Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009.

Panella:J Mater Process TechVol. 206 (2008), p. 249 8.
James: Eng Frac Mech Vol. 75 (2008), p. 341 14.
Rodopoulous:Int J FatigVol. 30 (2008), p. 2030 18.
Moretti:Int J FatigVol. 30 (2008), p. 198 19.
Wong, F.

J Clin Virol, 2008;42 :409-411 ].
Since the Hand-foot-mouth disease is epidemic in Taiwan in 1998, in 2008-2010, some regions in China have appeared the epidemic of the Hand-foot-mouth disease, and the death and severe cases of the enterovirus 71 infection is chief.
Since Hand-foot-mouth disease has been bringed in Class C infectious diseases of the national legal administration in May 2008, the nation Hand-foot-mouth disease outbreak occurred in several provinces and caused the emergence of more deaths[[] Wong KT, Munisamy B, Ong KC, ela1.
Neuropathol Exp Neurol, 2008, 67(2): 162-169 ].