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Online since: March 2007
Authors: Su Gui Tian, Xing Fu Yu, Ming Gang Wang, Hong Qiang Du, Fan Lai Meng, Z.Q. Hu
Tian 1 M.G.
S.G.Tian, X.Wu, H.C.
Yang, Z.Q.Hu�Metall.Mater.Trans., A�2001, Vol.32A: 2947 [5].
S.G.Tian, X.Wu, H.C.
Yang, Z.Q.Hu�Metall.Mater.Trans., A�2001, Vol.32A: 2947 [5].
Online since: January 2012
Authors: Fan Na Meng, Ying Wang, Guo Li Zhang, Long Qiang Wang, Guo Rui Chen, Shao Qiang Yang, Di Bao, Peng Gao
Yang, Y.
Yang.
Yang, et al.
Tian, N.
Yang.
Yang, et al.
Tian, N.
Oxidation Resistance and Insulation of AlPO4/Al2O3 Coating on Tungsten Substrate at High Temperature
Online since: January 2017
Authors: Ying Kun Xue, Ai Ling Fan, Wei Tian Li
Oxidation Resistance and Insulation of AlPO4/Al2O3 Coating on Tungsten Substrate at High Temperature
Ai-Ling FAN1,a,*, Ying-Kun XUE1,b, Wei-Tian LI1,c
1College of Materials Science and Engineering, Beijing University of Technology,
Beijing, China
afanailing@bjut.edu.cn,bxueyingkun@emails.bjut.edu.cn,cliweitian@emails.bjut.edu.cn
*Corresponding author
Keywords: Sol-gel, Tungsten Substrate, AlPO4/Al2O3 composite Coating.
Howthorne, Q .Yang, Surf.
[10] M.H.Zhou, Q.Z.Yang , T.Tom.
Howthorne, Q .Yang, Surf.
[10] M.H.Zhou, Q.Z.Yang , T.Tom.
Online since: June 2014
Authors: Ai Hua Tian, Dong Hui Shen
Acknowledgement
Ai Hua Tian thanks Electrochemical Energy Lab of Korea University for the helpful comments and discussions.
Yang, A.B.
[8] Chris Yang, S.
Yang, A.B.
[8] Chris Yang, S.
Online since: December 2013
Authors: Li Ma, Chun Chen, Zhe Wen Tian
Thermal Stress and Modal Analysis of Engine Exhaust Manifold
Chun Chen 1, a *, Li Ma 1, b, and Zhewen Tian 1, b
1 Automotive Engineering Institute of Wuhan University of Technology,
205 Luoshi Road, Hongshan District, Wuhan 430070, China.
Yang and M.M.
Yang, M.
Yang and M.M.
Yang, M.
Online since: November 2011
Authors: Ming Hui, Yin Chen Hou, Qing Tian, Xiao Li Shang, Kai Ping Zhang
Yang and X.H.
Tian and Y.C.
Tian and L.N.
Tian and Y.C.
Tian and L.N.
Online since: January 2013
Authors: Zhi Xue Wu, Shu Ai Tian
Singularity analysis for plane tri-material junctions
Tian Shuai1, a and Zhixue Wu1, b
1 Mechanical Engineering College, Yangzhou University, Yangzhou, 225009, P.
Yang and Munz [2] used the similar method analyzed stress intensity factors near the bi-material bonded edge under mechanical and thermal loading.
Munz and Yang [12] solved the stress intensity factors for the bi-material wedges by using finite element method.
Mech Vol. 74(1952), p. 526–528 [2] D.Munz, T.Fett, Y.Y.Yang: Engineering Fracture Mechanics Vol. 44(1993), p.185-194 [3] D.B.Bogy: Int.
Munz, Y.Y.Yang: International Journal of Fracture Vol. 60(1993), p. 169-177
Yang and Munz [2] used the similar method analyzed stress intensity factors near the bi-material bonded edge under mechanical and thermal loading.
Munz and Yang [12] solved the stress intensity factors for the bi-material wedges by using finite element method.
Mech Vol. 74(1952), p. 526–528 [2] D.Munz, T.Fett, Y.Y.Yang: Engineering Fracture Mechanics Vol. 44(1993), p.185-194 [3] D.B.Bogy: Int.
Munz, Y.Y.Yang: International Journal of Fracture Vol. 60(1993), p. 169-177
Online since: June 2012
Authors: Ya Nan Gu, Peng Li, Yu Jia Cui, Yong Liang Zhao, Wei Guo Wang, Tian Tian Meng, Jin Ju Ding, Peng Zhang, Ke Jia
Preparation of cortex moutan nanoparticles and its microscopic characteristics and physicochemical properties
Cui Yu-jia 1, a, Wang Wei-guo 1,b （correspondent） , Li Peng1,c , Zhao Yong-liang1,d, Gu Ya-nan1,e, Meng Tian-tian1,f，Ding Jin-ju1,g， Zhang Peng1,h，Jia Ke1,i
1Bioengineering College, Henan University of technology, Zhengzhou, Henan 450001, China
acyj19870402@yahoo.com.cn , b wwgwangwwg@qq.com , c lipengmail@163.com, dzylzhao@yahoo.com.cn, eyanan_gu@126.com, f939752051@qq.com, gdingjinju1258@163.com, hgyzhangchaoquan@126.com, ijiakesunshine@163.com
Keywords: Cortex moutan, Paeonol, super-micro-particle pulverization, dissolution, stability, fluidity
Abstract.
[3] Xu H B, Yang X L, Xie C S, et al.
[4] Xie C S, Yang X L, Xu H B.
[3] Xu H B, Yang X L, Xie C S, et al.
[4] Xie C S, Yang X L, Xu H B.
Online since: June 2013
Authors: Yu Huang Zheng
Tian: Journal of Computational Information Systems, Vol. 8(2012),p.8707
[3] S.
Yang: IEEE Trans. on Applied Superconductivity, Vol.20(2010), p. 1151 [8] P.
Yang:8th International Conference Electronic Measurement and Instruments(2007), p.382 [14] Endi, M.; Elhalwagy, Y.Z.: The 2nd International Conference on Computer and Automation Engineering (2010), p. 774 [15] H.Sakoe, S.Chiba:IEEE Trans. on Acoustics, Speech and Signal Processing, Vol.26(1978), p. 43
Yang: IEEE Trans. on Applied Superconductivity, Vol.20(2010), p. 1151 [8] P.
Yang:8th International Conference Electronic Measurement and Instruments(2007), p.382 [14] Endi, M.; Elhalwagy, Y.Z.: The 2nd International Conference on Computer and Automation Engineering (2010), p. 774 [15] H.Sakoe, S.Chiba:IEEE Trans. on Acoustics, Speech and Signal Processing, Vol.26(1978), p. 43
Online since: February 2015
Authors: Ze Cheng Xiong, Zhi Jun Luo, Hao Pang, Qiang Yin
Power Electronics, 2011, 45(7)：39-41
[3] ZHANG Jiu-qing, GAO Tian, JING Zhan-rong.
[6] OU Yang-qian, WU Guo-liang, QIAN Zhao-ming.
[8] BO YANG.
[6] OU Yang-qian, WU Guo-liang, QIAN Zhao-ming.
[8] BO YANG.