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Online since: September 2013
Authors: Quan Yuan, Xia Zhang, Jun Zhang, Xu Huang, Hua Cong
Valvular leaflets made with polymer materials of porcine or bovine pericardial can be opened or closed by ejected blood.
The properties of hyperelastic material is similar to rubber.
Acknowledgment This work was supported by grants from Natural Science Foundation of State (No: 31170906) and Key Laboratory of High Efficiency and Clean Mechanical Manufacture (Shandong University)Ministry of Education.
References [1] Zhao Shixiong, Luo Zhengxiang.The statue of arificial heart valve [J], Journal of Biomechnical Engineering, vol.8, pp.277-286, 1991
[6] G.Arcidiacono;A.Corvi;T.Severi;Journal of Biomechanics;38(2005)
The properties of hyperelastic material is similar to rubber.
Acknowledgment This work was supported by grants from Natural Science Foundation of State (No: 31170906) and Key Laboratory of High Efficiency and Clean Mechanical Manufacture (Shandong University)Ministry of Education.
References [1] Zhao Shixiong, Luo Zhengxiang.The statue of arificial heart valve [J], Journal of Biomechnical Engineering, vol.8, pp.277-286, 1991
[6] G.Arcidiacono;A.Corvi;T.Severi;Journal of Biomechanics;38(2005)
Online since: August 2014
Authors: Zhi Ying Ding, Zhi Ying Zhang, Jun Fu
(3)
The erosion rate is the material quality or volume loss caused by unit mass of particle impact on material surface.
Journal of Engineering for Gas Turbines and Power, Vol. 117(1995), p. 432 [2] Xiaoming Jiang, Zhiguang Ling and Xingyong Deng.
Journal of Engineering Thermophysics (In Chinese), Vol. 22(2001), p. 59 [3] Fengming Ju, Wanjin Hang.
Journal of Shanghai University of Engineering Science (In Chinese), Vol. 17(2003), p. 16 [8] W.
Journal of Engineering for Gas Turbines and Power, Vol. 114(1992), p.250
Journal of Engineering for Gas Turbines and Power, Vol. 117(1995), p. 432 [2] Xiaoming Jiang, Zhiguang Ling and Xingyong Deng.
Journal of Engineering Thermophysics (In Chinese), Vol. 22(2001), p. 59 [3] Fengming Ju, Wanjin Hang.
Journal of Shanghai University of Engineering Science (In Chinese), Vol. 17(2003), p. 16 [8] W.
Journal of Engineering for Gas Turbines and Power, Vol. 114(1992), p.250
Online since: December 2024
Authors: Tian Hong Gu, Shu Wei Jiang, Wen Su
Sample and Tensile Testing
Material and Sample Geometry.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
Online since: April 2016
Authors: Dong Lin Zhao, Wan Xin Zhang, Ran Ran Yao, Zhao Hui Qiang, Hui Dong, Huan Lin
Zhang: Microporous and Mesoporous Materials, (2015), p.130–136
Aller: Chemistry of Materials, Vol. 22 (2010), No. 20, p.5667-5671
Wang: Materials Letters, (2014), p.107–110
Zhang: New Carbon Materials, (2014) No.29, p.426–431
Ji: Materials Letters, (2014) No.122, p.273–276
Aller: Chemistry of Materials, Vol. 22 (2010), No. 20, p.5667-5671
Wang: Materials Letters, (2014), p.107–110
Zhang: New Carbon Materials, (2014) No.29, p.426–431
Ji: Materials Letters, (2014) No.122, p.273–276
Online since: April 2009
Authors: Travis Blackburn, David Butler, Leo Cheng Seng, Steven Danyluk
In this paper, a non-contact material removal technique based on the electrokinetic phenomenon is
proposed for precise material removal at rates in the order of nanometers/min.
A schematic on the experimental setup for electrokinetic material removal.
Thus the material removal mechanism can be considered to be a mechanical one.
REFERE�CES [1] R.J., Hunter: Zeta Potential in Colloid Science: Principle and Applications (Academic Press, London 1980)
Jimenez: Measurement and interpretation of the electrical conductivity of 1-alcohols from 273 K to 333 K (Journal of Molecular Liquids, Vol. 89 (2000), pp. 233-238
A schematic on the experimental setup for electrokinetic material removal.
Thus the material removal mechanism can be considered to be a mechanical one.
REFERE�CES [1] R.J., Hunter: Zeta Potential in Colloid Science: Principle and Applications (Academic Press, London 1980)
Jimenez: Measurement and interpretation of the electrical conductivity of 1-alcohols from 273 K to 333 K (Journal of Molecular Liquids, Vol. 89 (2000), pp. 233-238
Online since: October 2021
Authors: Shoroog Alraddadi
Therefore, the research and development of thermal insulation materials has recently become a hot topic in the field of building materials.
Materials and Methods Black scoria.
Materials Today: Proceedings, 26 (2020): 1964-1966
Journal of Physics Communications, 4.10 (2020): 105002
Journal of King Saud University-Science, 32.7 (2020): 2969-2975
Materials and Methods Black scoria.
Materials Today: Proceedings, 26 (2020): 1964-1966
Journal of Physics Communications, 4.10 (2020): 105002
Journal of King Saud University-Science, 32.7 (2020): 2969-2975
Online since: October 2012
Authors: Wen Hui Ma, Jie Yu, Rui Li, Jie Xing, Xiu Hua Chen, Jian Jun Yang
From the viewpoint of the materials and technology, it is necessary to operate the SOFC at lower temperature (600-800℃) [3].
Zhu: Progress in Materials Science Vol. 57 (2012), p. 804-874 [2] H.Y.
Yu: Journal of Rare Earths Vol. 28 (2010), p. 917-921 [3] B.W.
Moon: Journal of Materials Science Vol. 42 (2007), p. 1866-1871 [6] F.Mauvy, P.
Lalanne: Journal of Power Sources Vol. 171 (2007), p. 783-788
Zhu: Progress in Materials Science Vol. 57 (2012), p. 804-874 [2] H.Y.
Yu: Journal of Rare Earths Vol. 28 (2010), p. 917-921 [3] B.W.
Moon: Journal of Materials Science Vol. 42 (2007), p. 1866-1871 [6] F.Mauvy, P.
Lalanne: Journal of Power Sources Vol. 171 (2007), p. 783-788
Online since: May 2011
Authors: Yang Dong Hu, Qin He Sun, Lian Ying Wu, Yong Gang Li
At first, we supposed that[14]: (a) The properties of materials are isotropy during analysis.
Swain: Structure and Properties of Ceramics-volume 11 of Materials Science and Technology.
(In Chinese) [4] Xiaogang Wang, Yongsheng Liu and Xiaochi Li, et al: submitted to Xi'an University of Science & Technology Journal (2001).
(In Chinese) [7] Xiaochi Li, Xiaogang Wang and Xiaobin Guo: submitted to Journal of Inorganic Materials (2003).
(In Chinese) [9] Yuxian Tian, Xiaogang Wang and Yaping Zhang: submitted to Journal of Hunan University of Science & Technology (Natural Science Edition) (2009).
Swain: Structure and Properties of Ceramics-volume 11 of Materials Science and Technology.
(In Chinese) [4] Xiaogang Wang, Yongsheng Liu and Xiaochi Li, et al: submitted to Xi'an University of Science & Technology Journal (2001).
(In Chinese) [7] Xiaochi Li, Xiaogang Wang and Xiaobin Guo: submitted to Journal of Inorganic Materials (2003).
(In Chinese) [9] Yuxian Tian, Xiaogang Wang and Yaping Zhang: submitted to Journal of Hunan University of Science & Technology (Natural Science Edition) (2009).
Online since: November 2014
Authors: Can Xu
Empirical method is the first one to be used , but with the emergence of new materials, new technology, empirical method is not applicable in many ways; Analytical method mainly uses the space expansion theory and the theory of differential surface force source; numerical method is with the aid of computer technology, by finite element method or finite difference method to numerically simulate the problem of penetration, this method is of high speed, low cost, and can simulate the operation of the projectile trajectory.Thus,more direct, more used.
Five groups of tests were conducted, the object is ultra high performance cement-based composite materials Experiment, when the bullet into vertical target, first with the positive impact of concrete, and hardness, compressive strength of concrete itself, can have high stress zone around the spot for the impact of the child, while the concrete around the bullet in the head will produce radial compression stress wave, the bullet further into the target material, is a phenomenon of shear, extrusion, and the effect of free surface of the target for make the concrete material around the bullet point from the medium particles, eventually forming a kind of like a funnel pits and radial crack, formation of the pit area should be greater than the cross-sectional area of the bullet.
Journal of explosion and shock, 2002, 22 (4) : 368-371 [3] Kenedy R P.
Journal Southeast University,1991,21(1):1-7
Journal of PLA University of Science and Technology, 2005, 6(2) : 142-145.
Five groups of tests were conducted, the object is ultra high performance cement-based composite materials Experiment, when the bullet into vertical target, first with the positive impact of concrete, and hardness, compressive strength of concrete itself, can have high stress zone around the spot for the impact of the child, while the concrete around the bullet in the head will produce radial compression stress wave, the bullet further into the target material, is a phenomenon of shear, extrusion, and the effect of free surface of the target for make the concrete material around the bullet point from the medium particles, eventually forming a kind of like a funnel pits and radial crack, formation of the pit area should be greater than the cross-sectional area of the bullet.
Journal of explosion and shock, 2002, 22 (4) : 368-371 [3] Kenedy R P.
Journal Southeast University,1991,21(1):1-7
Journal of PLA University of Science and Technology, 2005, 6(2) : 142-145.
Online since: June 2014
Authors: Ling Bin Lu, Heng Mao, Xiao Yu Huang, Chong Lin, Yang Cao
The influence of SiO2 on properties of cellulose aerogel
Heng Mao, Xiaoyu Huang, Chong Lin, Lingbin Lu*,Yang Cao
Key Laboratory of Ministry of Education for Advanced Materials in Tropical Island Resources, College of Materials and Chemical Engineering, Hainan University, Haikou 570228 China
*lulingbin@126.com
Keywords: Cellulose; Silica; Aerogel.
Experiments Materials.
Microporous and Mesoporous Materials,Vol 181 (2012), p. 254
Journal of Petroleum Science and Engineering, Vol 61 ( 2013), p. 156
Progress in Polymer Science, Vol 26 (2001), p. 1605
Experiments Materials.
Microporous and Mesoporous Materials,Vol 181 (2012), p. 254
Journal of Petroleum Science and Engineering, Vol 61 ( 2013), p. 156
Progress in Polymer Science, Vol 26 (2001), p. 1605