Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys

Abstract:

Sn-Cu-Ni-Ge (SN100C®) is a high-performance Pb-free solder alloy widely used in the electronics manufacturing industry due to its excellent soldering performance and lower cost. SN100C has a huge potential to replace the commonly used Sn-Ag-Cu solders. This work investigates the effect of different strain rates (10^-3 to 8×10^-1s^-1) on tensile performance for bulk SN100C samples at room temperature. The tensile properties, e.g., elastic modulus (E), yield strength (σ_y) and tensile strength (σ_T) are determined from the stress-stress curves. The value of σ_y and σ_T increases with increasing strain rates and this increase becomes less prominent at higher strain rates. Necking and ductile fracture are observed for all samples with a significant number of dimples, voids and tongues formed. The level of ductility of the samples decreases with increasing strain rates, which is further confirmed by the stress-strain behaviour. The microstructural evolution of the samples is evaluated by optical microscope (OM), scanning electron microscope (SEM) and energy dispersive X-ray (EDX) to reveal the generation of recrystallisation and fracture of the intermetallic compounds (IMCs) at the fracture tips and identify the embedded of IMCs within the sample matrix.

• Periodical: Materials Science Forum (Volume 1133)
• Pages: 25-31
• DOI: https://doi.org/10.4028/p-wIm2oq
• Online since: December 2024
• Authors: Tian Hong Gu*, Shu Wei Jiang, Wen Su
• Keywords: Intermetallic Compounds, Optical Microscopy, Pb-Free Solder, SEM

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