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Online since: March 2007
Authors: Takayoshi Nakano, Yukichi Umakoshi, Takuya Ishimoto, Yasuhiko Tabata
The BAp orientation was finally concluded to be one of the most important indices to check the
regenerative degree and process in the regenerated bone under the tissue engineering technique.
Umakoshi: Tissue Engineering for Therapeutic Use 6, Edited by Y.
Mclntire: Frontiers in Tissue Engineering (Pergamon, U.K 1998) [13] K.
Forum Vol. 512, (2006), p. 261 [18] T.
Forum Vol. 512, (2006), p. 255
Umakoshi: Tissue Engineering for Therapeutic Use 6, Edited by Y.
Mclntire: Frontiers in Tissue Engineering (Pergamon, U.K 1998) [13] K.
Forum Vol. 512, (2006), p. 261 [18] T.
Forum Vol. 512, (2006), p. 255
Online since: May 2018
Authors: Oluwole Daniel Makinde, Malapati Venkateswarlu
Introduction
The study of non-linear, unsteady, natural convective MHD fluid flow through the duct is getting importance due to its many engineering applications, such as heat exchangers, building insulation, polymer extrusion, geothermal energy exploration, underground cables and chemical engineering.
Radiative heat transfer plays a very important role in many engineering systems operating at high temperature.
Thermal radiation in fluid flow with heat and mass transfer processes is of major interest in the design of many advanced energy conversion systems operating at high temperature.
Bull., Series D: Mechanical Engineering, 79(1) (2017) 91-106
Straughan (2010) Rotating porous convection with prescribed heat flux, International Journal of Engineering Science, 48(7/8) (2010) 685-692.
Radiative heat transfer plays a very important role in many engineering systems operating at high temperature.
Thermal radiation in fluid flow with heat and mass transfer processes is of major interest in the design of many advanced energy conversion systems operating at high temperature.
Bull., Series D: Mechanical Engineering, 79(1) (2017) 91-106
Straughan (2010) Rotating porous convection with prescribed heat flux, International Journal of Engineering Science, 48(7/8) (2010) 685-692.
Online since: May 2019
This conference provides a prominent international forum for reporting new developments in the areas of wide bandgap semiconductors (SiC, GaN, AlN, diamond, Ga2O3, ZnO, and etc.) and their device fabrication, including advances in the bulk and epitaxial growth, material structure and property, photoelectron and electronic device.
As many as 20 invited talks and 50 contributed presentations were given, providing a stimulating overview of the latest advances in wide bandgap semiconductors technology.
Liwei Guo (Institute of Physics, CAS, China) Yasuto Hijikata (Saitama University, Japan) Wei Huang (Fudan University, China) Chih-Fang Huang (National Tsing Hua University, Taiwan) Fengyi Jiang (Nanchang University, China) Zhanping Lai (The 46th Research Institut of China Electronic Technology Group Corporation, China) Chwan-Ying Lee (Hestia Power Inc., Taiwan) Kung-Yen Lee (National Taiwan University, Taiwan) Shunfeng Lee (Dongguan Institute of Opto-Electronics Peking University, China) Sooseong Kim (TRinno Technology, Korea) Bingbing Liu (Jilin University, China) Calvin Liu (Globalwafers Co., Ltd., Taiwan) Guoyou Liu (Zhuzhou CRRC Times Electric Co., Ltd., China) Xinyu Liu (Institute of Microelectronics, CAS, China) Xuechao Liu (Shanghai Institute of Ceramics, CAS, China) Guoquan Lu (Virginia Tech., USA) Hideharu Matsuura (Osaka Electro-Communication University, Japan) Tokuyasu Mizuhara (ROHM Semiconductor (Shanghai) Co., Ltd., Japan) Puqi Ning (Institute of Electrical Engineering
, CAS, China) Chulmin Oh (Korea Electronic Technology Institute, Korea) Tonghua Peng (TankeBlueSemiconductor Co., Ltd., China) Yufeng Qiu (Global Energy Internet Institute, China) Mark Ramm (STR Group, Inc., Russia) Bo Shen (Peking University, China) Guosheng Sun (Institute of Semiconductors, CAS, China) Koukou Suu (ULVAC, Inc., Japan) Xuhui Wen (Institute of Electrical Engineering, CAS, China) Ke Xu (Suzhou Institute of Nano-Tech and Nano-Bionics, CAS, China) Kouji Yamaguchi (Fuji Electric Co., LTD., Jpan) Anping Zhang (Xi'an Jiaotong University, China) Q.
As many as 20 invited talks and 50 contributed presentations were given, providing a stimulating overview of the latest advances in wide bandgap semiconductors technology.
Liwei Guo (Institute of Physics, CAS, China) Yasuto Hijikata (Saitama University, Japan) Wei Huang (Fudan University, China) Chih-Fang Huang (National Tsing Hua University, Taiwan) Fengyi Jiang (Nanchang University, China) Zhanping Lai (The 46th Research Institut of China Electronic Technology Group Corporation, China) Chwan-Ying Lee (Hestia Power Inc., Taiwan) Kung-Yen Lee (National Taiwan University, Taiwan) Shunfeng Lee (Dongguan Institute of Opto-Electronics Peking University, China) Sooseong Kim (TRinno Technology, Korea) Bingbing Liu (Jilin University, China) Calvin Liu (Globalwafers Co., Ltd., Taiwan) Guoyou Liu (Zhuzhou CRRC Times Electric Co., Ltd., China) Xinyu Liu (Institute of Microelectronics, CAS, China) Xuechao Liu (Shanghai Institute of Ceramics, CAS, China) Guoquan Lu (Virginia Tech., USA) Hideharu Matsuura (Osaka Electro-Communication University, Japan) Tokuyasu Mizuhara (ROHM Semiconductor (Shanghai) Co., Ltd., Japan) Puqi Ning (Institute of Electrical Engineering
, CAS, China) Chulmin Oh (Korea Electronic Technology Institute, Korea) Tonghua Peng (TankeBlueSemiconductor Co., Ltd., China) Yufeng Qiu (Global Energy Internet Institute, China) Mark Ramm (STR Group, Inc., Russia) Bo Shen (Peking University, China) Guosheng Sun (Institute of Semiconductors, CAS, China) Koukou Suu (ULVAC, Inc., Japan) Xuhui Wen (Institute of Electrical Engineering, CAS, China) Ke Xu (Suzhou Institute of Nano-Tech and Nano-Bionics, CAS, China) Kouji Yamaguchi (Fuji Electric Co., LTD., Jpan) Anping Zhang (Xi'an Jiaotong University, China) Q.
Online since: January 2022
Preface
The 5th International Conference on Materials Sciences and Nanomaterials (ICMSN 2021) and the 4th International Conference on Advanced Composite Materials (ICACM 2021) were held virtually via the ZOOM platform separately.
The ICMSN and ICACM conference series was initiated to promote research results in advanced materials science, mainly focusing on nanomaterials and advanced composite materials.
The conference provided a platform for discussions on real problems in nanomaterials, advanced composite materials, electronic materials, material chemistry, and materials processing technologies, to name a few.
They were selected based on their quality and relevance to the themes of the forums.
Alguno, MSU-Iligan Institute of Technology, Philippines Sarabjeet Singh Sidhu, Beant College of Engineering and Technology, India Rene Roy, Research Center for Aircraft Core Technology and ReCAPT, Gyeongsang National University, South Korea Prof.
The ICMSN and ICACM conference series was initiated to promote research results in advanced materials science, mainly focusing on nanomaterials and advanced composite materials.
The conference provided a platform for discussions on real problems in nanomaterials, advanced composite materials, electronic materials, material chemistry, and materials processing technologies, to name a few.
They were selected based on their quality and relevance to the themes of the forums.
Alguno, MSU-Iligan Institute of Technology, Philippines Sarabjeet Singh Sidhu, Beant College of Engineering and Technology, India Rene Roy, Research Center for Aircraft Core Technology and ReCAPT, Gyeongsang National University, South Korea Prof.
Online since: March 2010
Authors: Wen Ge Wu, M.X. Huang, W.T. Mei
MEIc
Department of Mechanical Engineering, North University of China , Taiyuan, Shanxi, 030051,
CHINA
a
3wwwg@163.com,
b
hmx@163.com, cmeiwt@163.com
Keywords: Reversible cutting, Bauschinger effect, Kinematic hardening models, Surface integrity
Abstract.
The different on the machining sequence between fine machining following the rough machining in advance stroke and fine machining in return stroke following the rough machining in advance stroke are compared.
In reversible cutting, the tool in reverse feed direction following the rough machining with advance stroke.
Meanwhile, it established the theoretical foundation in order to understand quantificationally Bauschinger effect of metal part, contrast and analyse the difference of plastic deformation, internal stress and work hardening of advance stroke finishing cutting and return stroke finishing cutting sequence Acknowledgements Financial support from the Shanxi province nature science foundation(Grant No.:2008011056)., key lab for advanced manufacturing technology of Shanxi province open foundation(Grant No.:2007031007) and the Shanxi provincial level university youth discipline leader foundation.
Materials Science Forum, Vols. 471-472 (2004) pp. 825-829
The different on the machining sequence between fine machining following the rough machining in advance stroke and fine machining in return stroke following the rough machining in advance stroke are compared.
In reversible cutting, the tool in reverse feed direction following the rough machining with advance stroke.
Meanwhile, it established the theoretical foundation in order to understand quantificationally Bauschinger effect of metal part, contrast and analyse the difference of plastic deformation, internal stress and work hardening of advance stroke finishing cutting and return stroke finishing cutting sequence Acknowledgements Financial support from the Shanxi province nature science foundation(Grant No.:2008011056)., key lab for advanced manufacturing technology of Shanxi province open foundation(Grant No.:2007031007) and the Shanxi provincial level university youth discipline leader foundation.
Materials Science Forum, Vols. 471-472 (2004) pp. 825-829
Online since: March 2008
This edition of the periodical "Materials Science
Forum" contains 30 contributions from authors from nine different countries around the world.
Starting with the silicon wafer material itself and emphasizing various aspects of the device from advanced gate dielectrics through to source/drain engineering, this issue ends with a summary on fully silicided gates.
If not supported and pushed ahead by a few scientists and engineers, the technology would probably have disappeared a few years later again.
Beyond that he supported the community by editing and co-organizing the International RTP conferences as well as the German RTP Users Group Meetings, providing inputs to the German "Arbeitskreis Heizprozesse" within the VDE/VDI - Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik (GMM) and teaching young scientists and engineers at international seminars.
Starting with the silicon wafer material itself and emphasizing various aspects of the device from advanced gate dielectrics through to source/drain engineering, this issue ends with a summary on fully silicided gates.
If not supported and pushed ahead by a few scientists and engineers, the technology would probably have disappeared a few years later again.
Beyond that he supported the community by editing and co-organizing the International RTP conferences as well as the German RTP Users Group Meetings, providing inputs to the German "Arbeitskreis Heizprozesse" within the VDE/VDI - Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik (GMM) and teaching young scientists and engineers at international seminars.
Online since: March 2011
Authors: Mark J. Loboda, Roman Drachev, Michael Dudley, Balaji Raghothamachar, Edward Sanchez, Darren M. Hansen, Sha Yan Byrapa, Gloria Choi, Huan Huan Wang, Fang Zhen Wu, Stephan G. Mueller
Loboda2
1Department of Materials Science and Engineering, Stony Brook University, Stony Brook, New York, 11794, USA
2 Dow Corning Compound Semiconductor Solutions, Midland, Michigan, USA 48686
amdudley@notes.cc.sunysb.edu, bedward.sanchez@dowcorning.com
Keywords: Threading Dislocation, Shockley Partial, Burgers Vector c+a, Macrostep, Overgrowth, Synchrotron White Beam X-ray Topography
Abstract.
Loboda, Materials Science Forum, 645-648, pp. 291-294, (2010)
Forum 353–356, 727 (2001)
Forum, 600-603, 261-266, (2009)
Forum, 338-342, pp. 431-436, Trans Tech Publications, Switzerland, (2000)
Loboda, Materials Science Forum, 645-648, pp. 291-294, (2010)
Forum 353–356, 727 (2001)
Forum, 600-603, 261-266, (2009)
Forum, 338-342, pp. 431-436, Trans Tech Publications, Switzerland, (2000)
Online since: July 2015
Preface
This special issue of Defect and Diffusion Forum contains selected peer-reviewed papers presented
at the tenth International Conference on Diffusion in Solids and Liquids (DSL-2014) held at the Tapis
Rouge Paris, France during the period 233r-27th June, 2014.
Rocha), DIFFUSION PROCESSES AND REACTIONS IN ENGINEERING ALLOYS (SS2) (by H.
Celata ENEA - Division of Advanced Technologies for Energy and Industry, ITALY N.
Rocha), DIFFUSION PROCESSES AND REACTIONS IN ENGINEERING ALLOYS (SS2) (by H.
Celata ENEA - Division of Advanced Technologies for Energy and Industry, ITALY N.
Online since: April 2012
Preface
ACAM2012 is a comprehensive conference,and it is an integrated conference concentrating
its focus upon Materials and Mechanics in Architectonics and Materials Engineering.
In the proceeding, you can learn much more knowledge about Materials and Mechanics in Architectonics and Materials Engineering of researchers all around the world.
In order to meet high standard of Advanced Material Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Architectonics and Materials Engineering fields with a free exchanging forum to share the new ideas, new innovation and solutions with each other.
In the proceeding, you can learn much more knowledge about Materials and Mechanics in Architectonics and Materials Engineering of researchers all around the world.
In order to meet high standard of Advanced Material Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Architectonics and Materials Engineering fields with a free exchanging forum to share the new ideas, new innovation and solutions with each other.
Online since: December 2010
Therefore, it is an integrated conference concentrating
its focus upon Engineering Materials,Information Technology,Energy, Management and Control.
In the proceeding, you can learn much more knowledge about Engineering Materials,Energy, Management and Control of researchers all around the world.
In order to meet high standard of Advanced Materials Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Engineering Materials,Energy, Management and Control based on modern information technology with a free exchanging forum to share the new ideas, new innovation and solutions with each other.
In the proceeding, you can learn much more knowledge about Engineering Materials,Energy, Management and Control of researchers all around the world.
In order to meet high standard of Advanced Materials Research,the organization committee has made their efforts to do the following things.
The goal of the conference is to provide researchers from Engineering Materials,Energy, Management and Control based on modern information technology with a free exchanging forum to share the new ideas, new innovation and solutions with each other.