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An excavation in Iznik uncovered a huge amount of ceramic potteries and significant number of tiles, vitreous materials along with nearby kilns and other debris [1].
Macroscopically all the frits consist of white quartz grains varying in size in a green glassy matrix and black-purple glassy inclusions.
The glass matrix that is creating a degree of rounding around the quartz grains is not uniform and differs in terms of silica lead and tin.
The typical cracking around the edge of the quartz grains is due to the volume reduction that occurs during the phase transition from α to β at 573°C.
The formation of crystobalite adjacent to quartz grains can be seen in all of the tin frit fragments.

A number of solid wastes from various sources are generated in the refinery manufacturing process.
The obtained grain sizes were in range from 0.5 to 0.2 mm.
On the other hand, the sand grains may high workability of the concrete.
The compressive strength of sulfur concrete in this study is less than in previous study [10] because of the differences in grain sizes.
The obtained grain size of sand in previous study is 2 mm.

When the tap comes across the hard grains, the tap torque will increase suddenly because of the uneven hardness of material, and as the torque achieves a critical value, the tap will be broken unavoidably
If the tap breaks through the hard grains, the ratio coefficient t（s） Mα Mβ M - The variation waveform of tapping torque ........
(3) When the tap comes across the hard grains, the tapping torque increases sharply because of the uneven material.
After the cutting edge breaks through the hard grains, there are two cases analyzed above.
Tab.2 The experiment data The collecting number The tapping torque(n.m) 4iM − 3iM − 2iM − 1iM − iM 1 5.35 5.51 5.72 5.76 6.19 2 4.32 4.43 4.72 5.21 6.17 3 4.41 4.53 5.13 5.42 6.17 4 5.42 5.65 5.73 5.91 6.07 The workpiece material is Q235.

Fig.1 Principle of MRF (a)single magnetic body effect (b) cluster magnetic body effect Fig.2 The principle of the cluster MR-effect plane polishing (a) Structure of the device （b）Real picture of the device 1- clamping workpiece device 2- rotary polishing disk 3- machine body 4- recycling and storing device 5- adjustable magnetic device Fig.3 The cluster MR-effect plane polishing device When magnetic bodies are arranged regularly on the non-magnetic disk, a polishing disk made up of a number of tiny-grinding wheels with cluster MR-effect can be obtained, as shown in Fig.2(b).
Furthermore, the abrasive grain could escape from the tiny-grinding wheel under the centrifugal force, micro-cutting force and collision.
So the abrasive grain could be refreshed.
At the same time, larger abrasive grains sank into the soft polishing pad, thus surface damage from abrasive grains is reduced.
Thus there is have the ideal speed of the polishing disk according to the magnetic field intensity, the size and type of the grain.

Introduction EBSD is a versatile tool providing grain size determination, orientation mapping, phase identification and 3D mapping.
Furthermore, diamond polishing is not recommended, because it can deform the grains on the surface.
The commonly suggested colloidal silica polishment continues for hours and can embed residual polishing material in the surface grains.
To eliminate the orientation dependence of the band intensities (consequently the IQ) large area (more than 25 grains) was measured to have reliable IQ average.
The EBSD measurement step interval between points was chosen to have the same number of measured points for all samples.

Botanists and Mathematician have achieved fruitful results after a lot of work on the grain configuration of the sunflower.
Vogel[7]first put forward the plate grain configuration model of the sunflower in the plane, such as Fig. 1.This model vividly describes the grain configuration structure of the sunflower plate surface.
In order to more clearly and directly express the distribution on the surface of the grain in the sunflower plate, H.
The origin of the polar coordinate system is atthe center of the phyllotactic pattern.is a grain ordinal number on the surface of the sunflower plate, from the polar center to count.describes the angular constant for the phyllotactic pattern and is aconstant between successive seeds. is the polar distance of the n-th seed， is a spacing constant describing the packing of seeds，which is called phyllotactic coefficient.

This influences the elongation of the system more than the improving interaction on the phase borders above 100 kGy dosage since in case of larger grain size, the surface/volume ratio decreases.
This small extent decrease refers to the decrease in the size of the polyethylene crystallites that can be caused by the increasing number of cross-links.
There is an obvious relation between grain size and the change in the tensile mechanical properties.
This is reflected by the fact that tensile strength decreased as grain size of the PE increased.
Between 150 and 200 kGy grain size did not change, and the tensile values also decreased only to a small extent.

The technical and economic effect has been improved greatly, and occupies an important position in fine grained lean ore and many other areas.
Thus make fine grained weak magnetic mineral in twenty thousand gauss the following conventional magnetic separator is difficult to separate the material get effective separation; 2) Great capacity of production.
It consists of a number of solenoid compositions, no filling medium.
After pulp into the separation tube, magnetic mineral grains in magnetic effect through the hole in the wall separating into separation pipe, water flow to the magnetic field outside, become concentrating.
The magnetic mineral grains from inside separation tube end discharge, become tailings.

It was thus necessary to understand the effect of grain size and morphology on the material removal mechanisms of silicon wafers by stepwise polishing using a fixed abrasive pad.
The purpose of this polishing experiment is to investigate the effects of grain size and manufacturing method on surface roughness improvement.
The features of pit and scratch are still on the surface, though they are now less in number.
A series of polishing experiments for silicon were carried out using diamond, silicon carbide, and alumina, with different grain sizes and polishing parameters, as abrasives.

A bonding time of 60 minutes resulted in a two-phase microstructure consisting of large Cu6Sn5 grains within two layers of Cu3Sn with fine columnar grains and a thickness of about 4 µm at each side (Fig. b, e).
Fig. 4c shows that the crack path in Cu3Sn/Cu6Sn5 mainly grows through the large Cu6Sn5 grains and occasionally follows the interface of the two IMCs.
Severe cracking of the Cu6Sn5 grains is an indication of large internal stresses within this layer (Fig. 4c).
Only a few number of Cu3Sn joints failed by fracture of joint under the given testing conditions.
Reliab. 85 (2018) 1-11 [11] Lei Sun, Ming-he Chen, Liang Zhang, Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints, J.