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Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits Hiroyuki Saiki1, Yasuo Marumo 1a, Hiroshi Nishitake2, Masahiro Hazama1, Fuminori Sakata 1 1 Department of Mechanical Engineering and Materials Science, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555, Japan 2 Sony Semiconductor Kyusyu Ltd, Japan a marumo@gpo.kumamoto-u.ac.jp Keywords: Deformation characteristics, Epoxy molding compounds, IC package Abstract.
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Materials donated by _Shin Zu Shing Co., LTD are greatly appreciated.
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Introduction Generally, composite materials are heterophase systems obtained from two or more components with preservation of the individuality of each component [1, 2].
Methods for the practical use of the obtained materials are proposed.
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Special attention should be paid to their raw materials and products, the potential of these raw materials for recycling and whether they are produced in the local area or are the by-products of other corporations.
The raw materials mainly include straws and the excrement of livestock and poultry
Besides, the excrement can be used by the organic fertilizer factory as raw materials
The change of materials is mainly used to describe the environmental influence of EIP.
The premise of the formula is that the materials of input and output are regarded as the same.

Materials and Methods All materials used are of analytical grades.
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Materials and Methods The Test Instrument.
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This material can be used in solar energy[11,12,13], gas sensors[14], photocatalytic water splitters [1] and other semiconductor devices and analytical devices.
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Supramolecular elastomers were synthesized using vegetable oil materials namely palm acid oil (PAO) and sunflower oil (SFO).
Experimental Materials.
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