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Online since: November 2022
Authors: Nadjem Bailek, Adel Khalil, Mohamed H. Yehia, Muhammed A. Hassan, Nabeel Abed
El-Bakry, M.A.
El-Bakry, M.A.
El-Bakry, M.A.
El-Bakry, M.
El-Shimy, N.
Online since: August 2013
Authors: Ragaa Abd El-Hakim, Sherif El-Badawy
International Roughness Index Prediction for Rigid Pavements: An Artificial Neural Network Application Ragaa Abd El-Hakim 1,a, Sherif El-Badawy 2, b 1Assistant professor, Faculty of Engineering, Delta University for Science and Technology, Gamasa, Egypt. 2Assistant professor, Public Works Engineering Department, Faculty of Engineering, Mansoura University, Mansoura 35116, Egypt.
[3] Al-Omari, B., and Darter M.
Online since: May 2013
Authors: Ning Zhang, Hong Min Kan, Ting Ting Fu, Xiao Yang Wang, Miao Sun, Fei Yi Yang
El-Sherik, et a1: J Appl Electrochem.
Pogany, et al: Surf & Coat Technol.
Le, et al: Applied Optics, in China.
El-Sherik, J.
Liu, et al: Electric Processing and Mould, in China.
Online since: October 2010
Authors: Xue Qun Cheng, Sheng Jie Lv, Zuo Jia Liu, Xiao Gang Li
El Bakri, at el.
Saatchi, et al.
Online since: February 2008
Authors: Bong Ki Ryu, Young Seok Kim, Tae Ho Kim, Young Joon Jung, Kyu Ho Lee
Abd El-Maksoud, et al.: Mater.
El Alaily: Materials Chemistry and Physics Vol. 52 (1998), p. 175
Online since: February 2013
Authors: Zheng Liu, Lin Yang, De Wen Zhao, Zhong Li Zhang, Hong Liang Shan, Lin Yang
a force force 13 16 40 b <1 3~4 notch Pure Al AZ91 Fig. 1 Tensile shear schematic of AZ91/Al Al a Fig. 2 SEM image of interface microstructure of AZ91/Al composite (a) and corresponding element line scanning analysis (b) Results and discussion Interface microstructure analysis of AZ91/Al composite.
At the Al side there is a layered gray area.
The Al side are totally composed of pure Al, and AZ91 microstructure is composed of a uniform α-Mg(Al, Zn) solid solution, where α-Mg solidly solute Al and Zn elements.
When the basic solder dissolves into the interface, Al and α-Mg(Al, Zn) naturally dissolve into the interface, and the Al content in the interface microstructure will increase.
Du, E.L.
Online since: September 2015
Authors: S.C. Sharma, V.M. Nimbalkar, B. Bhanushali, M. Mohape, S.G. Pandav, V.P. Deshmukh, S. Dineshraj, Mayukh Acharya, Alok Agarwal, Govind Govind
In the present development, Al base thin wall components for electronic packaging applications were produced by rheocasting process.
Raw materials used ccommercially available Al – Alloy (A 356).
The chemical composition of the NRC die cast were mets as per specified chemical composition of (Al-0.7Si-0.3Mg).
(MPa) % El NRC as cast 85 110 223 22 NRC after (T6) 120 268 321 12 4.0 Conclusions: This research report described the efforts made by NMRL, to developed thin walled standard deels chassis components for electronic packaging applications by using new rheocasting die casting processing technology.
By properly fine-tuning in-gate geometry and process parameters sound, near-net shape castings without porosity, higher strength with higher ductility could be fabricated with much ease. 6.0 References: [1] Richard et al, US 6,640,879 B2, (Nov. 4,2003) [2] Oril, US 6,595,266 B2, (Jul. 22, 2003) [3] Norville et al., US 6, 432, 160 B1, (Aug. 13, 2002) [4] Lombard et al., US 2003/0102103 A1; (Jun. 5, 2003) [5] Flemings et al., US 2003/0079854, A1, (May 1, 2003) [6] Aoyama et al., US 2003/0062144, A1, (Apr. 3, 2003) [7] Winterbottom et al., US 2003/0037900, A1, (Feb, 27, 2003) [8] Flemings et al., US 2002/0096231, A1, (Jul. 25, 2002) [9] Adachi et al., EP 0 745 694 A1, (Dec. 1994) [10] Adachi et al., US 6, 165, 411, (Dec. 2000) [11] J.
Online since: February 2011
Authors: Hui Juan Xiong, B. Yu
An aggregate homotopy method was given for solving min-max-min programming by Bo Yu el al.
Online since: March 2018
Authors: Atef S. Hamada, Mohamed Abdel Hady Gepreel, Sally Elkatatny
Gepreel1,b and Atef Hamada1,c 1Department of Materials Science and Engineering, Egypt–Japan University of Science and Technology, New Borg El-Arab City, Alexandria 21934, Egypt aSally.elkatatny@ejust.edu.eg, bMohamed.gepreel@ejust.edu.eg, cAtef.Hamada.
Introduction High Entropy Alloys (HEAs) have presented a new class of materials different from conventional alloys, such as Fe-, Al-, Cu-, Ti- and Ni-based alloys, which are based on one principal element and the total quantum of solute atoms is not large in many cases [1].
Chang, ‘Microstructure Characterization of Al x CoCrCuFeNi High-Entropy Alloy System with Multiprincipal Elements’, vol. 36, no.
Chang, ‘Mechanical Performance of the Al x CoCrCuFeNi High-Entropy Alloy System with Multiprincipal Elements’, vol. 36, no.
Liaw, ‘Effect of Microstructure on the Deformation Mechanism of Friction Stir-Processed Al 0 . 1 CoCrFeNi High Entropy Alloy’, vol. 3, no. 1, pp. 30–34, 2015
Online since: September 2013
Authors: Dan Qing Zou, Bo Zhang
ItemVerify Input: begline line and end line of one item Output: Item list has been verified Vlist 1 bl=begin line of the item; el=end line of the item;FI=Filter-Index 2 While (bl<>el){ 3 Pi=Pf=bl; 4 ItemType=FI.get(bl.fontsize); 5 IF(ItemType.num>1) 6 { 7 While(Pi.fonttype= =Pi+1.fonttype) 8 { If (Pi.fontfeature= =Pi+1.fontfeature) 9 If (Pi.spacing= =Pi+1.spacing) 10 Pi=Pi+1; 11 } } 12 Vlist.add(Pf, Pi); 13 Pf=Pi; 14 } 15 Return Vlist; Experiments and analysis A.
[3] Chao Guang Li, Ming Zhang, et al.
[4] Min Yuh Day, Richard Tzong Han Tsai, Cheng Lung Sung, et al.
[5] Hu Y H, Li H, CaoY B, et al.
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