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SUN Chunjuan[2] and TIAN Huaiwen[2] raised a linear method for cone fitting.
[7]Tian Huaiwen, Guo Shizhang.
[9]Qu Xuejun, Yang Yawen, Han Zhiren, Quadric Surface Direct Fitting Based on Normal Vectors of Random Data[J].

Tian, M.S.
Tian, G.S.
Yang, Y.

Alam et al. [4] has showed that the stress intensity factors (SIF) increases with the thickness of solder alloys at the loading rate of 0.8 MPa/s for the crack located at 1μm distance apart from the IMC-solder interface.The size effect on the shear strength of as-reflowed and aged Sn3.0Ag0.5Cu/Cu solder joints was significant revealed by Tian [2].
[2] Yanhong Tian, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin, Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing, Materials Science and Engineering A 529 (2011) 468– 478

Yang: Carbohydr.
Tian, X.
Tian, M.

References [1] Gong Chang-lu，Tian Xiao-dong，Fu Bai-zhou，Zhao Chun-ying，Wang Tian-zhi，Zhang Ji-feng.
[2] Feng Weng-guang，Hu Chang-zhong，Yang Feng-bo.

[2] TIAN YJ, LI T, JIANG WL, et al.
[3] SHE HP, YANG SX.

Thermal Stress of Early-Age Concrete Made with Different Cement Compositions XIN Jianda1,2,3,a *, LIU Yi1,2,3,b, ZHANG Guoxin1,2,3,c, WANG Zhenhong 1,2,3,d ,YANG Ning4,e and QIAO Yu4,f 1State Key Laboratory of Simulation and Regulation of Water Cycle in River Basin, China Institute of Water Resources and Hydropower Research, Beijing, 100038, China 2Key Laboratory of Construction and Safety of Hydraulic Engineering of Ministry of Water Resources, China Institute of Water Resources and Hydropower Research, Beijing, 100038, China 3Department of Structure and materials, China Institute of Water Resources and Hydropower Research, Beijing, 100038, China 4 China Three Gorges Projects Development Co., Ltd., Chengdu, 610017, China a*xinjd@iwhr.com, bliuyi@iwhr.com, czhanggx@iwhr.com, dwangzh@iwhr.com, e459279519@qq.com, f1206049994@qq.com Keywords: temperature stress testing machine; thermal stress; temperature history Abstract.
[2] Li H, Tian Q, Zhao H, Lu A, and Liu J (2018) Temperature sensitivity of MgO expansive agent and its application in temperature crack mitigation in shiplock mass concrete.

Automation of Electric Power System, vol. 28 (2004), p.17-21 [3] Yongxi Zhang, Hongming Yang and Mingyong Lai. 2010 International Conference on Power System Technology, vol. 32 (2010), p. 1-6 [4] Rockafeller T and Uryasev S.
Journal of Banking and Finance, vol. 26 (2002), p. 1443-1447 [5] Tian Chao, Shen Chen, Sun Yingyun.

A Novel Medical Image Registration Based on Contour Features and MultiScale information Yang Yunfeng1,a, Lin Chengxin1,b, Wang Pengxiao1,c, Li Jia1,d, Li Bo2,e 1School of Mathematics Science and Technology, Northeast Petroleum University, Daqing 163318, China 2College of Mathematics and Information Science,Nanchang Hangkong University, Nanchang 330063, China aemail: yfyang@nepu.edu.cn, bemail:fyydq@tom.com, cemail: wangpengxiao.nepu@gmail.com, dlijia19880107@126.com eemail:bolimath@gmail.com Keywords: Registration; Multiscale Information; Resampled Contour line; Hierarchical Abstract.
[5] Chen J., Tian J.

Yang: J Power Sources Vol. 195 (2010), p. 2118 [3] Z.H.
Tian: Advanced Materials Research Vols. 97-101 (2010), p. 510