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Introduction Micromachined gyroscope is the key research field because it is widely applied in both civil and military field [1,2].
Structure of a capacitive micromachined gyroscope Fig. 1 shows the structure of a capacitive micromachined gyroscope.
There are two movable directions as shown in Fig 1, one is the driving direction (marked as X direction in Fig 1), the other is the sensing direction (marked as Y direction).
References [1] R.
Journal of Microelectromechanical Systems. 2006,15(3):479-491 [5] C.

The amount of aluminium and magnesium in the sample was comparable with the theoretical composition as shows in Table 1.
The average microhardness values of pre-treat annealed at low temperature (300 ºC) and high temperature (520 ºC) is shown in Fig. 1.
Fig. 1 Hardness values of cryorolled sample with various dipping time Tensile Test.
References [1] K.
Perform. 11 (2002) 479-480

Introduction Yarn unwinding from stationary packages has an important role in many textile processes[1,2,3,4,5,].
Materials and Method Fig.1.
References [1] Padfield, D.
A, 436 479-498
Theory of yarn unwinding off a package. 1, derivation of differential equations, 45(5-6) 119-123

These parts are often made by pressure casting, because of the low plastic of the aluminum alloy [1].
The initial blank and the extruded specimens are shown in Fig. 1.
Fig. 1 A comparison of the initial blank and the extruded specimens Effect of temperature and strain on mechanical property.
References [1] R.
A Vol. 479 (2008), p. 1-9 [3] M.Y.

The typical scenarios and system boundaries are shown in Fig. 1.
Fig. 1 Scenarios and system boundaries Allocation.
All inventory data sources used in this study are given in Table 1.
Table 1.
Aubertin, et al., Life cycle assessment of mine tailing management in Canada, Journal of Cleaner Production 17 (2009) 471-479

Indeed, electrochemical etching is an efficient process to perform porous regions in SiC substrates as demonstrated for the first time by Shor and coworkers [1].
A double tank electrochemical cell was specially designed by our lab and fabricated by AMMT ® to anodize samples with diameters ranging from 1 to 15 cm.
Fig. 1.
References [1] J.S.
Poveda, RF planar inductor electrical performances on n type porous 4H silicon carbide, IEEE Electron Device Lett. 33(4) (2012) 477-479.

Ultrafine grained copper alloys processed by continuous repetitive corrugation and straightening method Wojciech Głuchowski1a Jerzy Stobrawa1,2, Zbigniew Rdzawski1,2, Witold Malec 1 1 Non-Ferrous Metals Institute, ul.
Fig. 1.
Before processing grains diameters were in range 1 – 22 μm (most of them were 2-3 μm), after RCS processing grains diameters were in range 1 – 3 μm (most of them were much below 1 μm) In fig. 9 histogram of misorientation angle of grain boundaries is presented.
Malec „Microstructure and properties of CuNi2Si1 alloy processed by continuous RCS method Journal of Achievements in Materials and Manufacturing Engineering vol 37 issue 2 December 2009 s466-479 [10] J.
Malec „Microstructure and properties of CuNi2Si1 alloy processed by continuous RCS method Journal of Achievements in Materials and Manufacturing Engineering vol 37 issue 2 December 2009 p466-479

Withers, An Introduction to Metal Matrix Composites, Cambridge University Press, Cambridge, 1993, 1
Arifin, Materials Science & Engineering A2012, 1-5
[47] Gupta, M. and Wong, W.L.E., Scripta Mater. 2005, 52, 479-483
Wong, Scripta Materialia 2005, 52, 479-483
Kamarudin, International Review of Mechanical Engineering2013, Vol. 7, N.1

All the work is done under the familiar environment using standard menus and toolbars [1].
General procedure of the material structure modeling has been depicted in Fig.1.
-Material definition for P002--> + -discrete points definition, together 479 nodes, including XYZ values--> + Vol.1, pp. 53-67

Some of standards are widely adopted in the world, such as IEEE-80-2000, IEC-471-1, EA-TS41-24 and BS7354.
Some of standards are widely adopted in the world, such as IEEE-80-2000, IEC-471-1, EA-TS41-24 and BS7354.
According to the current time curve as showed in Fig.3 in IEC-471-1, this grounding grid meet the safety standards.
References [1] Chen Xianlu, Liu Yugen and HuangYong.
General Aspect 479-1 IEC, (1984)