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Online since: December 2015
Authors: Joydeep Dutta, Mayuree Jaisai, Muhammad Najam Khan
Journal of Colloid and Interface Science, 2004. 275(1): p. 177-182
Science and Technology of Advanced Materials, 2009. 10(1): p. 013001
Science and Technology of Advanced Materials, 2010. 11(5)
Materials Research Bulletin, 2014. 49(0): p. 645-650
Materials Science in Semiconductor Processing, 2015. 36(0): p. 124-133
Online since: October 2013
Authors: Yong Zhang, Shou Yan Chen, Chun Yu Ma, Gui Fang Chen
[11]Qi Xin-Hua,Zhuang Yuan-Yi.Application of supercritical fluid technology in environmental science [M].Beijing:Science Press,2005,49-57
Journal of Hazardous Materials,2009,61(1):1-20
Zhao.Journal of Hazardous Materials,2009, 170(1):66–71
Journal of Hazardous Materials,2009, 170 (1):191-196
[19] Xiu Furong,Zhang Fushen..Journal of Hazardous Materials,2009,165(1-3):1002-1007
Online since: September 2013
Authors: Feng Qing Zhao, Xiao Meng Chu, Hui Jiao Yang, Shao Jie Liu
Therefore, surface-initiated ARGET ATRP polymerization has become an effective method for modifying the surface of materials.
Therefore, surface-initiated ARGET ATRP polymerization has become an effective method for modifying the surface of materials.
Zhou, New Chemical Materials, 2012,40(7), pp. 21-24 [11] A.
Milena, Journal of Membrane Science, 2011, 385-386, pp. 30-39 [18] Jonsson M., D.
Nordin, European Polymer Journal, 2009, 45, pp. 2374-2382
Online since: March 2008
Authors: Stephen Abela, Maurice Grech
RIBAD deposition of TiN, on Magnesium Alloy Stephen Abela a and Maurice Grech b University of Malta, Faculty of engineering, Department of Metallurgy and Materials, Msida MSD06, Malta ssabel@eng.um.edu.mt a , mgrech@eng.um.edu.mt b Keywords: TiN, ion implantation, magnesium alloy, AM50.
Published by the American society of materials.
Zou: Journal of Applied Physics A, Material Science and processing, Volume 56, No6, 1993, pages 561-565. 8) Jochen M.
Voevodin, and Allan Matthews: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Volume 15, Issue 3, 1997, pages 1084-1088. 9) S.
Mitamura, Materials Science and Engineering, Volume A263, 1999, pages 205-209. 10) Y.
Online since: August 2013
Authors: Bo Chen
These three materials were screened with stand sieve, and took particle size of 0.088-0.076mm for the test.
Figure 2 shows microscopic images of these three materials.
Journal of Hydrodynamics, 2007, 19(4): 453-458
Journal of Hydrodynamics, 2010, 22(5): 349-353
Journal of Hydrodynamics, 2012, 24(4): 518-525
Online since: March 2011
Authors: Xi Peng Xu, Hui Huang, Cong Fu Fang, Guo Qin Huang, X.H. Yu, H. Guo
This might be related to the different material removal mechanisms for two kinds of materials.
In grinding of ceramic, materials dominantly removes in brittle mode.
Shi.: Grinding of Difficult-to-cut Materials.
Huang and etal.: Journal of Mechanical Engineering, Vol.45, 2009(3), pp:100-114 [7] X.M.
Journal of Materials Processing Technology, Vol.210 (2010), pp: 899–906
Online since: September 2013
Authors: Zhi Cai Yu, Peng Liang, Hua Ling He
Adsorption of Acid Red G Dye from Solutions by Raw Bentonite and Bentonite- Cationic Starch Composite Hualing He1,a, Zhicai Yu1,b, Peng Liang1,c 1Colleage of Chemical Engineering and Material Science, Eastern Liaoning University, 325 Wenhua Road, Dandong, Liaoning, 118003, China aEmail: hehualinghe@126.com, bemail:yuzhicaicai@163.com, cemail:liangpenglong@163.com Keywords: Adsorption, RB/CS composite, Raw bentonite, Kinetics, Equilibrium Abstract.The adsorption of acid red G dye onto raw bentonite/cationic starch(RB/CS) and raw bentonite (RB) was investigated in aqueous solution in a bath system with respect to the adsorption kinetics and adsorption isotherms, respectively.
In summary, the results showed that RB/CS could be employed as low-cost materials for the removal of acid red G dye from effluents compared to RB.
Experimental Materials The raw bentonite (RB) used in this study was obtained from Sangong Chemical industry Co.Ltd.
Guo: Journal of Hazardous Materials. 161 (2009), p. 126 [2] B.
Özcan: Journal of Colloid Interface .276 (2004), p. 39 [6] Y.Y,Qin,Q.Li,B.Y.Gao,A.J.Yuan and Y.Wang: Science Direct. 35 (2007), p. 268
Online since: February 2014
Authors: Mohd Faizul Mohd Sabri, Dhafer Abdul Ameer Shnawah, Suhana Binti Mohd Said, Nur Aishah Aminah Mohd Amin
Ngoh, "Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints," Journal of Electronic Materials, vol. 33, pp. 1219-1226, 2004/10/01 2004
Sonje, "Material issues in electronic interconnects and packaging," Journal of Electronic Materials, vol. 30, pp. 372-378, 2001/04/01 2001
Tanaka, "Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects," Journal of Electronic Materials, vol. 32, pp. 1527-1533, 2003/12/01 2003
Che, "High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications," Journal of Electronic Materials, vol. 41, pp. 2631-2658, Sep 2012
Che, "Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications," Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, vol. 551, pp. 160-168, Aug 15 2012
Online since: June 2010
Authors: Mieczyslaw Siemiatkowski
Journal of Intell.
Journal of Adv.
Journal of Adv.
Journal of Flex.
Journal of Prod.
Online since: July 2011
Authors: Sheng Dun Zhao, Yong Yi Li
ASME Journal of Manufacturing Science and Engineering 2005; 127(829): 829-836
ASME Journal of Manufacturing Science and Engineering 2006; 128(65): 65-73
Key Engineering Materials. 431-432(2010)
[14] Ivanov, V., Kirov, V., 1996, Rolling of internal threads: Part 1, Journal of Materials Processing Technology, 72: 214-220
JOURNAL OF MATERIALS ENGINEERING, 2000(4): 41-44.
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