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Bainite in microalloyed steel possesses excellent synthetic mechanical properties.
Introduction The excellent synthetic mechanical properties of ultra low carbon bainite (ULCB) steel are derived from fine non-equilibrium microstructure [1-3].
The involved pre-deformation will change dislocation density and dislocation-precipitate interaction state, which could affect microstructure evolution during subsequent thermal disturbance.
After heated isothermally at 1200°C for 3 hours, the ingots were subjected to thermal mechanical controlled process.
After mechanical polishing, the samples for optical observation were etched with a 3% nital.

The Influence of Geometry of Pedestal Piles in Silt on Uplift Behavior HAO Dong-xue1, a*, ZHANG Jin-zhong1,b and CHEN Rong1,c 1School of Civil Engineering and Architecture, Northeast Dianli University, Jilin, Jilin Province, China ahaodongxue2005@126.com, bjincui521521@126.com, clg1316cih@126.com Keywords: uplift behavior; rigid pedestal piles; silt; model test Abstract: The uplift behavior of rigid pedestal pile is affected by the geometry, which is not totally same with plate anchor.
The lateral boundaries of tank is about 5.8~11.6 times diameter of pile base, which will not affect the uplit behavior of piles.
Soil properties and preparation The soil sample is commercial silt of Shulan Town in Jilin City.
Table 1 Physical and mechanical parameters of Shulan silt (g/cm3) wop (%) c (kPa) (o) wL (%) wP (%) 1.77 17 16.0 20 23 14 Test plan The objectvie of present test is to investigate the influence of geometry of piles including the angles of enlarged base, ratio of base to shaft diameter, embedment ratio.
Table 2 Test plan list Influence factors Test name H/D d(mm) D(mm) (o) Angle of enlarged base S1-1 3 114 228 0 S1-2 15 S1-3 30 S1-4 45 S1-4 60 Ratio of base to shaft diameter, D/d S2-1 3 114 171 45 S2-2 228 S2-3 342 Embedment ratio, H/D S3-1 2 114 228 45 S3-2 3 S3-3 4 Results Influence of the angles of enlarged base The relationships of uplift load and displacement of half-cut models were plotted in figure 2(a), herein, uplift resistances include the weight of piles.

Both the migration activation enthalpy and the pre-exponential mobility factor were found to increase with rising impurity concentration.
Besides the applied stress grain boundaries experience also a curvature driving force for their displacement, which can even be affected by triple junctions.
Therefore, grain boundary properties, particularly with respect to their response to an applied stress, are most appropriately studied on specific boundaries with exactly defined geometry in specially grown bicrystals.
Misorientation dependence of measured (points) and calculated (lines) coupling factors for the investigated <100> symmetrical tilt grain boundaries.
Both the migration activation enthalpy and the pre-exponential mobility factor increase with rising impurity concentration.

The further development of PAEKs synthesis and properties, as well as creation of materials with new properties based thereon is still relevant.
All these factors were taken into account and used in various combinations in optimizing the preparation process of polyarylene ether ketones.
Structure and properties of heat resistant polymers.
Properties and application of special plastics.
Synthesis and properties.

The shear strength of rocks was influenced by internal and external factors whose presence can reduce the shear strength of rocks.
Introduction Rocks in the field are discontinuous, anisotropic, and heterogeneous materials so that the physical and mechanical properties of rocks can vary even for rocks with the same lithology.
The shear strength of rocks is influenced by internal and external factors whose presence can reduce the magnitude of the shear strength in rocks.
One of the most common factors is the discontinuous plane that separates the blocks in the rock mass.
Physical properties test, physical properties test is carried out to see rock characteristics related to rock strength during mechanical testing.

Introduction All The nickel based material Inconel 690(IN 690 superalloy), which offer a excellent corrosion resistance and mechanical properties at elevated temperatures, is widely used for steam generators tubes in pressurized water nuclear reactors of nuclear power plants [1].
The hot extrusion process has been applied in order to reach the required properties.
The inhomogeneous deformation is an important factor for superalloy tube during the hot extrusion process, which affecting the quality of products.
The results of numerical simulation strongly depend on the input data regarding the physical properties of materials.
Glass lubrication condition is an important factor of hot extrusion process, because it directly affect the stress field, temperature field and squeeze pressure distribution, which impact on the uniformity of deformation.

Carbon fiber reinforced plastics (CFRP) are used as structural materials in automotive and aerospace industries because of its superior properties like high strength to weight ratio and high stiffness to weight ratio.
Fiber orientation is the key factor that determines the surface integrity of machined component [6-9].The tool-chip interface is the major source of friction in cutting, hence a major source of energy dissipation.
In this paper cutting temperature and tool wear were taken as the important factors influencing the surface quality of the edge trimmed CFRP materials.
It is found that the carbon fiber orientation greatly affects surface roughness.
[8] Venugopala Rao G, Mahajan P and Bhatnagar N, Micro-mechanical modelling of machining of FRP composites – Cutting force analysis, Composites Science Technology 67 (2007) pp.379-593

The solution properties and moisture absorption-retention abilities of the salts were compared with chitosan.
The properties of the salts were related to the type of carboxylic acid added and the formation of salt bond.
In this paper, their structures were characterized and their properties were also evaluated.
Solution properties.
The intermolecular hydrogen bonds of molecular chains, which affect the interaction between water and polymer chains directly, may be a very important factor to regulate moisture absorption-retention abilities of CCS.

A Vacuum Sucking Approach to Preventing Chips from Attaching to Machined Surface in Cutting of KDP Crystals Ziwen Zheng1,2,a, Haofeng Chen1,2,b , Yifan Dai 1,c , Hang Gao 3,d, Guilin Wang1,e and Xiaoping Li2,f 1 Department of Mechantronical Engineering and Automation, National University of Defense Technology, China 2 Department of Mechanical Engineering, National University of Singapore, Singapore 3 Dalian University of Science and Technology a zzwxj@sohu.com, bchenhf-nudt@hotmail.com, cdyf@nudt.edu.cn, dhanggao@sohu.com, ewgl@nudt.edu.cn, fmpelixp@nus.edu.sg Keywords: KDP crystal; Ductile mode cutting; Preventing chips; Vacuum sucking Abstract.
Researcher Chen M.J. analyzed critical cutting condition for brittle-ductile transition of KDP crystals in ultra-precision machining, he stated the mechanical characteristics of KDP crystal anisotropy, the tool rake angle, and cutting parameters are main factors for ductile cutting KDP crystals [4, 5].
The Influence of Chips on 'Fogging' of Crystals Fogging of the crystal surfaces was the key factor influencing the efficiency of KDP frequency conversion arrays on the laser system.
Other cutting parameters such as feed rate and depth of cut had some influence on the removal of chip, but are not key factor for removal of chip.
[2] Ma Encai: Research on Mechanical Properties of KDP Crystal in Ultra-precision Machined Surface (Harbin Institute of Technology Publications, China 2006)

This paper surveys some properties and characteristics of SiC wafers purchased in the commercial market place and describes the product variability among vendors as a method to highlight the areas where improvements in substrate quality are desirable.
There, discrepancies in counts of a factor of 2 or more have been observed.
The band edge peak intensity appears to be greatly affected by polish quality and subsurface damage.
For stepper lithography, focus and exposure are affected by the resultant surface of the wafer, which determines the definition of fine line-widths over the exposure fields of the wafer.
Over time this has proven to be a more repeatable and easier measurement technique than using mechanical calipers or laser techniques.