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Online since: May 2024
Authors: Ruben Cuamatzi-Melendez, Fernando Juárez-López, Melchor Salazar-Martínez
Introduction The misorientation angle between adjacent grains of steels, has become one of the major concerns for the study of some mechanical and toughness properties of irons [1-5], carbon steel [3, 6], stainless steel [7-8], other types of steels [8-10] and different alloys [11-12].
Hwa Hong, Characterization of boundaries and determination of effective grain size in Mn-Mo-Ni low alloy steel from the view of misorientation, Scr.
Kacher, Influence of misorientation angle and local dislocation density on β-phase distribution in Al 5xxx alloys, Sci.
Zhu, Advances in the mechanism of cleavage fracture of low alloy steel at low temperature.
Tyson, Crack arrest toughness of a heat-affected zone containing local brittle zones, Journal of Offshore Mechanics and Arctic Engineering 118 (1996) 292–299
Online since: March 2023
Authors: Emiru Yidnekachew Melesse, Solomon Workeneh Jima, Assefa Taye Endale
Chromium compounds are contained in wastewater from electroplating industries formed during chromium plating, during chemical etching and surface passivation of parts made of ordinary, galvanized and cadmium steel, copper alloys during electro-polishing of steel parts, and during electrochemical anodizing of aluminum parts.
Journal of chemistry,(2020)
Journal Water Processing Engineering, 10(2016) 56–66
Journal of Hazardous materials, 112(2004) 207 – 213
Journal of Water Process Engineering, 33(2020)
Online since: January 2019
Authors: Chun Feng, Ya Qiong Cao, Rui Zhe Li, Li Juan Zhu
The present work is mainly aimed to introduce the characterization methods and potential applications of graphene modified anticorrosive coating for tubing.
These studies are focused on the evolution of the microstructure of graphene coating during the experiment was determined by the variety of element compound before and after the modification of graphene and solidification of graphene coating at the marine environment simulating condition.
Acknowledgements This work received the support of the Basic research and Strategic reserve Technology Fund of CNPC (2017Z-04): Applied basic research on the application of graphene technology on the surface treatment of tubing ,Major science and technology projects of Petro China Co Ltd (2018E-11-06): Key technologies for improving development level in complex fault block oilfield at high water cut stage, and The scientific research and technology development project of CNPC(2018D-5010-08): Development of 720MPa titanium alloy drill pipe.
Journal of the Graduate School of Sun Yat-sen University. 29 (2008) 54-61
The Chinese Journal of Nonferrous Metals. 21 (2011) 165-70
Online since: December 2014
Authors: Dong Ming Zhang, Ming Ming Hu
However, they are particularly susceptible to localized corrosion by chloride and reducing sulfur compounds[6].
Journal of Separation Science.
Journal of Coatings Technology and Research.
Polymer Journal.
Journal Physical Chemistry.
Online since: December 2012
Authors: Xin Ying Wang, Yu Qi Liu, Yue Bin Feng, Jing Wang, Xiao Jun Xu
When smelting of these ores that are mined for their metals , arsenic and arsenical compounds could enter the effluent in the dissolved form through industrial discharges from metallurgical industries[2].
The new substances on the surfaces of iron chips might be alloy, elemental metal , metal oxides and arsenates, it could be presumed.
Seen from Fig.13, it confirmed that many Cu(II) were displaced and removed from the copper smelting effluent, which had new states of element metal, alloy and oxides.
Table.2 Removal rate under optimal conditions of the combined process Species Total arsenic COD Cu2+ Pb2+ Ni2+ Fe2+ Fe3+ Initial content (mg·L-1) 153.0 146.4 104.5 74.8 15.5 391.3 97.4 Residual content(mg·L-1) 0.43 10.98 1.24 1.32 0.08 1.72 0.94 Efficiency (%) 99.7 92.5 98.8 98.2 99.5 99.6 99.0 Conclusions The current study aimed at evaluate the efficiency of arsenic removal from copper smelting effluent.
Hu: Journal of Tianjin Polytechnic University Vol. 28(2009), p.62 [6] H.
Online since: January 2026
Authors: Rilwan Kayode Apalowo, Alfred Kareem, Gift Ukpoweh, David Somefun, Elijah Oyeleke, Emmanuel Kehinde, Ebenezer Ikudehinbu
The results offer practical insights for electronics manufacturers aiming to improve process throughput and reliability in advanced packaging by selecting suitable nanoparticle-enhanced underfill formulations.
The aim of this research is to conduct data-driven optimization of nanoparticles-reinforced underfill encapsulation in Ball Grid Array (BGA) Assemblies through the investigation of the impact of nanoparticle materials and their weighted percentages.
Ramli, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling, Journal of Electronic Packaging, 147(1), 2025a. https://doi.org/10.1115/1.4065805
Liang, Modeling and simulation of underfill flow in flip-chip assemblies, Journal of Electronic Packaging, 134(2), 020901, 2012
Ramli, Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test, Soldering and Surface Mount Technology, 36(3), 154–164, 2024. https://doi.org/10.1108/SSMT-12-2023-0075
Online since: September 2006
Authors: Wolfgang H. Müller
Clearly, in the development of new electronic packages, the aim is to lower the cost, increase the packaging density, and to improve the performance while still maintaining or even improving the reliability of the components.
The results of these reactions by diffusion are intermetallic compounds (e.g., Cu6Sn5 or Cu3Sn, [4]), which form in a characteristic scallop-like shape and ripen to become relatively thick intermetallic layers: right inset of Fig. 3.
Moreover it represents a nonlinear partial differential equation (PDE) of 4th order which describes the temporal development of α- and β-phases in a binary alloy A-B [5,6].
Rather there is a supply of grain material due to the interfacial reactions between the solder alloy and the copper.
Müller: International Journal of Solids and Structures, Vol. 37 (2000), pp. 3841-3871
Online since: January 2010
Authors: Heinz Palkowski, Gerhard Ziegmann, Adele Carradò, Olga Sokolova
The aeronautic industries always have been a source and driving force for the development of new materials and material compounds.
The aim of this research is to define a set of relevant parameters for the characterization of selected SMs systems (e.g. steel/ polymer/steel) developed for reducing noise, heat transfer or vibrations as well as weight in automotive, naval industries, building applications, etc.
Data: mean ± SD (n = 5) The mechanical properties of the polymer (PP-PE foil), the metal (steel and aluminium alloys) and their interface determine the strength of the sandwich.
Fleck, International Journal of Mechanical Sciences, 46 (4) (2004), p.585608
Online since: July 2022
Authors: Thomas Bergs, Anh Tuan Vu, Robert H. Schmitt, Hendrik Mende, Paul Alexander Vogel, Christian Strobl, Tim Grunwald
The global LED market is projected to grow at a compound annual growth rate (CAGR) of 12.5% during the forecast period from 2021 to 2028 [2].
To enable the mass production, current research aims at replicating several lenses in one press cycle using wafer-scale concepts.
Fig. 4 Process chain of the wafer scale process In nonisothermal glass molding, high-alloy steels or alloys with high chromium and nickel contents are used in general [14].
Bergs, Machine learning-based predictive modeling of contact heat transfer, International Journal of Heat and Mass Transfer 174 (2021) 121300. https://doi.org/10.1016/j.ijheatmasstransfer.2021.121300
Khoo, An LCA study of a primary aluminum supply chain, Journal of Cleaner Production 13 (2005) 607–618. https://doi.org/10.1016/j.jclepro.2003.12.022.
Online since: January 2012
Authors: Yun Shuai, Guo Bin Lv, Xiang Yang Jia, Quan Yu Wang, Shi Ying
Aereal uses Alloy, a first-order relational language, ACME for architecture description, and their associated tool sets.
Based on the principles mentioned above and the universal classification and comparison frame of ADL in Reference [3], aiming at the exception handling of architecture layer, the paper abstracts the SOA supporting exception handling(as shown in Fig.1).
If a message type has a complex data structure, namely, it is compounded by many simple data types.
StructuredAction is an action compounded by multi-action according certain temporal relations.
a) Spring, Berlin 2009 [6] S.L.Marcos, Z.Qayyum , “Representing service-oriented architectural models using pi-adl”, ECSA 2008,LNCS 5292, pp.273-280 [7] YANG Xin, CHEN Jun-Liang, “An Architecture Description Language for Web Services Component System”, Journal of Software.2006,17(005), pp,1182-1194 [8] Rao Yuan, Feng-Boqing and Li-Zunchao, “ALBC4WS:A Dynamic Service Composition Framework Based on the software Architecture Lifecycle”, Journal of Computer Research and Development.2005,42(02), pp.2063-2069 [9] Xiangyang Jia, Shi Ying et al, “A New Architecture Description Langu-age for Service-Oriented Architecture”, In proceeding of Sixth Internation-Conference on Grid and Cooperative Computing(GCC 2007).16-18 Aug, 2007, pp.96-103 [10] JIANG-Zheyuan, HAN-Jianghong ,WANG Zhao, “Service-oriented Software Architecture Description and Construction Using XML”,Journal of Chinese Computer Systems,2008,29(8), pp.1437-1444 [11] F.F.Castor, P.H.Brito, C.M.Rubira, “Specification of exception