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Preface The 2nd International Conference on Materials and Applications for Sensors and Transducers, Budapest, Hungary, taking place one year after the 1st meeting in Kos, hosted about 240 oral and poster papers and more than 150 participants.
For all of us, working in the field of materials and applications of sensors and transducers (material and sensor designers, sensor users and other personnel involved in instrumentation and measurement) the existing and established conferences in this particular field suffer from two distinguished and recognized drawbacks: the first is the increasing orientation in integrated systems and micro-nano electronic technology, while the second refers to very specific meetings related to either materials for sensors (i.e.
Publishing the conference proceedings in the form of 4-page papers in a compact volume of Key Engineering Materials which has a certain large impact in CPSI, while long versions of complete research articles are subject of publication in Sensor Letters and the Journal of Optoelectronics and Advanced Materials, both ISI Journals IV.
Vlachos, University of Peloponnese, Department of Computer Science and Technology Committees Damianos Sakas, University of Peloponnese S.
Popescu, Editor-in-Chief, Journal of Optoelectronics and Advanced Materials P.

Materials and Methods Materials.
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The joining of dissimilar materials is of great importance in industry.
In this study, stainless-steel and aluminum materials which is the example material was used in the friction welding experiments.
In the experiments, AISI 304 austenitic-stainless steel and aluminum materials were used.
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American Society for Testing and Materials (ASTM) standard D 3359-09 cross cut tape test was performed to examine the adhesion between the film and substrate.
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Zhu, Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities, International Journal of Minerals, Metallurgy and Materials 16 (2009) 685-690
Thompson, Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer, Journal of Alloys and Compounds 862 (2021) 158043
Kim, Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints, Journal of Materials Science: Materials in Electronics 30 (2019) 7645-7653
Yamanaka, Electromigration in Solder Joints, Journal of The Japan Institute of Electronics Packaging 23 (2020) 219-223
Liu, Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package, Journal of Materials Science & Technology 34 (2018) 1305-1314.

In the 21st century, science and technology have moved toward renewable raw materials and more environmentally friendly and sustainable resources and processes.
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Material properties of composite material components.
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During process of steel gate design, primary problems including the facts that materials bill generation by hand are time and energy-consuming[1]; 3D modeling depends on a unit of specific project without scientific management in graphics structure, classification and hierarchy, thus the low transferability and repeating utilization factor[2].
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Fig. 1: Measuring setup Materials Within the project, which was financially supported by the Czech Science Foundation, various fine-grained cement composites were produced.
Taşdemir: Nondestructive testing of materials and structures.
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However, the optimal design simply based on the minimum of entropy generation rate often results in a larger size of heat sink and a waste of materials [7].
The thermal conductivity of the fin material is k.
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Saedodin, Entropy generation minimization of pin fin heat sinks by means of mataheuristic methods, Indian Journal of Science and Technology, vol. 6(7), pp. 4886-4893, 2013
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