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The crystallite size was enlarged with increasing Rw; in other words, the number of H2O bonds in the synthesis of TiO2 increased as the number of Ti-OH bonds increased as a consequence of reacting between TTIP and H2O.
The crystallite size increased as Rw increased due to number of Ti-OH bonds as the nuclei of TiO2 much more formed.
Mohammed., Correlation between thickness, grain size and optical band gap of CdI2 film, Eng. and Tech.

The simulation was repeated for several times and at each new stage, the mesh was rebuilt so that the number of elements in critical regions decreased.
The number of recurring calculations was set to 3, the degree of grinding of the mesh during the rebuilding was set to 2 and the permissible level of convergence was set at 5%.
Acknowledgement We hereby acknowledge the support of the Ministry of Science and Education of the Russian Federation, in accordance to the decree of the Government of April 9, 2010. № 218, the project number 03.G25.31.0234.
Pal-Val. et. al., Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing.

It is obvious that both electrical conductivity and gas permeability of anode substrate are strongly related to the microstructural parameters such as grain size, composition and spatial distributions of the constituent phases [4-6].
The connectivity of Ni CNi is given by the following equation [8], mL NiL NiL Ni PP P C , , ,24 4 + = (1) where PL,Ni and PL,m are the number of point intersections per unit length of test line with Ni-Ni and Ni-matrix interfaces, respectively.
The interparticle penetration between the neighboring granules is believed to be responsible for the enhanced electrical conductivity with increased number of conduction paths.
In addition, regarding the population of electrochemical reaction site which is corresponds to the number of triple phase junction among Ni, YSZ, and pore in the anode substrate, further investigation is required to achieve the optimum anode microstructure with minimal activation polarization.

Number of fatigue cycles of each phase was 1.2×107, and total cycles through both phases were 2.4×107.
Numbers of fatigue cycles in phases 1 and 2 were defined as N1 and N2 respectively.
Acknowledgment This work was supported by JSPS KAKENHI Grant Number 20k04237.
Ritchie, Microstructural mechanisms of cyclic fatigue-crack propagation in grain-bridging ceramics, Ceramics international 23 5 (1997) 413-418

A number of potential sources can lead to generation of new inclusions, such as reoxidation [1,2] , reaction between steel and runner refractory [3,4], While a number of sources could supply oxygen for reoxidation, the pickup of oxygen by the steel stream from the surrounding atmosphere is one of the most important. [5-7] Industrial studies have evidently shown that using a protective shroud of inert gas such as argon can reduce the number of inclusions and lower the nitrogen as well as hydrogencontents in the steel [8,9] .
The tracing particles , used in this experiment, whose average grain diameter is approximately 5μm, is produced by No.9308 smoke generators assembled by TSI Corporation.

Introduction The grain boundary structure of TiC/Fe cermet sensitively affect its combination of strength and toughness, and experimental results have found that the transition elements (such as Ni, Mo, etc.) adding to TiC/Fe cermets play an important role in improving the interfacial bonding strength and toughness [1-4].
Nslab and Nbulk are the number of formula units contained in the slab and the bulk supercells, respectively.
In Fig. 1 the atoms with numbers 1-7 represent the Ni-doped substitution position as listed in Table 2.
A is the interface area, n is the number of Ni-doped atoms, μNi is the chemical potential of Ni atom taken as a Ni atom energy in Ni unit-cell, μX is the chemical potential of X atom to be replaced by Ni atom.

SOPC Builder provides a large number of IP-based Avalon, it also is an open IP integration environment.
It is a broad prospect of the processor, into a number of new design methods and concepts, the SOPC concepts embodied in the following areas [6]: Nios II is according with industrial technology development trend, namely hardware design- soft wared.
Fig. 1 Stratix FPGA overall development process flowsheet HardCopy Series Devices and Product Development HardCopy series device architecture based on the fine grain size is known as Hcell transistor array.
Acknowledgements The paper, with the Number 11541312, is subsidized by scientific and technological research project of Department of Education of Heilongjiang province.

As we know, the temperature 1200°C will make a dramatic grain growth of 1Cr18Ni9Ti.
Table 3(a) Results of shearing strength experiments Number Temperature Strength(MPa) Average(MPa) Russia standard 1# 20℃ 503 527 441.0~529.2 MPa 2# 551 3# 200℃ 545 483 421.4~441.0 MPa 4# 421 5# 400℃ 390 400 326.6~392.0 MPa 6# 410 7# 600℃ 292 261.5 205.8~323.4 MPa 8# 231 9# 700℃ 179 202 186.2~215.6 MPa 10# 225 Table 3(b) Results of stress-rupture tests Number Stress(MPa) Temperature(℃) Time(h) Russia standard 11# 78 700 145broke ≥100h 12# 150worked well Table 3(c) Results of low cycle fatigue tests Number Stress(MPa) Temperature(℃) Cycles Russia standard 13# 137.2 20 ＞1.01×107 ＞107 14# 15# 98 700 ＞1.01×107 16# Conclusions (1) The filler metal bmp7 shows an ideal high temperature behavior when brazing 1Cr18Ni9Ti stainless steel.

The reason for this was that the amount of grains being cut in unit time rises, and the times of grinding surface to be impacted increase, fatigue strength of granite descended.
When the speed of belt increased, the increasing of the number of grits engaging cutting in unit time and the reduction of cut thickness of single grit, cause the elastic deformation of cutting trace of grits to decrease and the surface roughness to drop.
While increasing the rotating speed of table, the number of grits cutting materials in unit time decreased, the cut depth and grinding force were increased so that the elastic deformation of workpiece surface became greater and the surface roughness was increased.
SEM pictures indicate that after grinding with surfactant coolants, the micro-cracks and the number of craters on the granite surface increased.

Acute Cu toxicity can result in a number of pathologies, and in severe cases, death.
Plants copper poisoning main symptom is: Root elongation was disrupted, Browning deformity, "Chicken feet root", Leaf yellowing and brown spots, to inhibit the germination of seeds and grain development[16,17].
Usually copper into the body mainly accumulates in the liver, once more than the level of treatment of the liver, could easily cause oxidative inactivation of the enzyme system, the damage of red blood cell, and leading to the denatured hemoglobin increasing; meanwhile copper combined with the hemoglobin can result in a large number of denaturing hemoglobin into the blood, eventually lead to hemolytic anemia.
In the endocrine system, the small number of patients may appear impotence and non-secreting pituitary adenoma, which perform for ofobesity, facial flushing and hypertension.