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Online since: August 2013
Authors: Rini Riastuti, Muhammad Anis, Permana Hariansyah, Mohammad Fadli, Fisca Sunandar Arif, Ghazali Galih, Indra Pratama Alief
This is the reason why SAF 2707HD hyperduplex stainless steel has an excellent resistance to pitting and crevice corrosion having pitting resistance equivalent number (PRE) of 49 based on formula PRE = %Cr + 3.3%Mo + 16%N [2].
These carbides gowth rapidly along grain boundaries or in the interface austenite-ferrite at temperature of 700°C - 900°C[13].
This is shown in Figure 1(b) at the weld metal and Figure 2 (b)-(c) at the HAZ as black dottet distributed at austenite phase and in the grain boundaries of ferrite-austenite phases as reported by Zucato et.al[20].
Online since: January 2020
Authors: O.A. Chikova, Ksenya Yu. Shmakova, Irina Brodova, Vladimir S. Tsepelev
In particular, spreading the melt of copper laterally and vertically along grain boundaries of steel substrate is preferred.
Atoms Cu penetrate along grain boundaries of substrate and provide a path for Ga diffusion in steel.
Layer of solder CuSnBiInCd it has many pores, their number increases near substrate.
Online since: October 2016
Authors: Mathias Liewald, Daniel Heydt, Christoph Seyboldt
This alloy was produced by the company SAG (Austria) and is very suitable for semi-solid forming process, because of its relatively wide solidification interval (∆T = 58 K) and it has a finely grained globular microstructure after the electromagnetical stearing during solidification.
Fig. 1: Solid phase fraction over temperature for A356 (Scheil equation) In order to avoid any undesired growth of grains during the heating process of the aluminium slugs, heating should be as fast as possible to reach the desired microstructural condition.
These samples showed a clear foam structure without compression and only a low number of ruptures in the ceramic webs for all liquid fractions.
Online since: July 2011
Authors: Ning Bo Cui, Xing Ye Yu
And it is also the periodical achievement of the Startup Foundation for Scientific Funds in Northeast Agricultural University, which is named “Research on the supportive policy of the soybeans industry based on the security of soybeans industry ” (Program Number:2009RC06).
In 1997, the consolidated average price of soybean in national grain wholesale market was 3.1yuan/kg, which continued to fall for several years and became 2.07yuan/kg in 2001.
Online since: March 2005
Authors: M. González, M. Domenech, G. Lifante
A way of increasing the number of photons absorbed by a given surface is to define periodic structures with a period lower or greater than the wavelength of light.
The optical surface finish was reached by polishing with a series of diamond suspensions of reduced grain size, ending with a smooth silica gel.
Online since: January 2010
Authors: Jun Hua Gu, Jie Song, Na Zhang, Yan Liu Liu
In this paper, it's simple and efficient of web page level extraction, with target of extracting the theme information, but not fine-grained data.
We get the number of its sibling nodes, set the serial number of its child node as 0, insert into the public XPath expression.
Firstly, define three variables, save the serial numbers of child nodes, the numbers of child nodes and step length values.
The initial value is the serial number of initial child node.
As show in table 1and table 2,the total number of data to be collected(#T) is 423.Since there are two formats about the information points of 2688 and joyo amazon shops, when the provided samples number(#N) is 2,the number of actual extracted information points(#E) is 366,in which 360 information points is correct(#C) ,and the average value of F is 75.23%,when the provided samples number is 3,the average recall value is 99.17%,the average precision value is 99.17% and the average value of F is 99.17%.
Online since: April 2012
Authors: Galina I. Zmievskaya, Anna L. Bondareva, V.V. Savchenko, Tatiana V. Levchenko
(5) Here Uij(r) corresponds to an indirect interaction of blisters with each other; Usurf(r) corresponds to the blister interaction with all surfaces of the layered structure (the interaction mechanism is the same), including the irradiated surface; Uph(r) corresponds to the interaction with lattice defects of the dislocation type and grain boundaries; and Upore(r) is the potential of the blister–pore interaction for porous materials.
If where k is an integer number, k³1 that , where Vblister is the blister volume, Vvac is the vacancy volume.
Results of numerical simulation of blister-pores evolution with number of interacting particles 300, number of trajectories 107, time step for size change is 10-9s, time step for migration is 10-8s, number of time step for size change is 105, number of time step for migration is 104.
The number of trajectories is 107, time step for size change is 10-9s, time step for migration is 10-8s, number of time step for size change is 105, number of time step for migration is 104.
Results of numerical simulation of cone blister-pores evolution with number of interacting particles 300, number of trajectories 107, time step for size change is 10-9s, time step for migration is 10-8s, number of time step for size change is 105, number of time step for migration is 104.
Online since: May 2019
Authors: Xiao Long Chen, Chun Jun Liu, T.H. Peng, B. Wang, Y. Guo, Y.F. Lou, N. Zhao, W.J. Wang
The total defect number of the epitaxial layers grown on the "epi-ready" 4-inch SiC wafer is 63, and the usable area is 97.6%, indicating the high quality of our SiC substrates. 1.
Various defects, such as hexagonal voids, inclusions, micropipes, polytype transformation, small-angle grain boundaries, and dislocations, are easily formed in the crystals due to the variation of these processing parameters.
The total number of 4-inch wafer micropipe is 3, far less than 0.1/cm2, and “zero micropipe” is realized.
The defect numbers on the whole surface of epitaxial layers is 63, and the usable area is 97.6%, as shown in Fig. 17b.
The total defect number of the epitaxial layers grown on the "epi-ready" 4-inch SiC wafer is 63, and the usable area is 97.6%, which fully meets the requirements of device manufacturers and verified the high quality of our SiC wafers.
Online since: November 2007
Authors: Zhao Hui Deng, Ya Dong Gong, Qi Jing, Zhong Wei Hu
Experimental Investigations on Surface Residual Stresses in the As-sprayed and Ground Nanostructured WC/12Co Coatings Zhaohui Deng1,a, Zhongwei Hu1,b, Qi Jing 1 and Yadong Gong2 1 National Engineering Research Center for High Efficiency Grinding, Hunan University Changsha, China, 410082 2 School of Mechanical Engineering & Automation, Northeastern University, Shenyang, China,110004 a edeng0080@vip.sina.com; bhuzhongwei2003@yahoo.com.cn Key words: Nanostructured WC/12Co coatings, Surface grinding, residual stresses, Experimental Investigation Abstract: In this study, a number of experiments on surface grinding of nanostructured WC/12Co (n-WC/12Co) coatings were conducted on a precision surface grinding machine with a horizontal axis and rectangular worktable.
Table 1 The properties of n-WC/12Co coating Powder grain size [nm] Density [g/cm 3 ] Fracture toughness [MPa.m 1/2 ] Vickers hardness [GPa] Elastic modulus [GPa] Poisson's ratio 30.00~50.00 14.50 5.50 13.50 405.00 0.30 ` Fig.1 SEM observations of the as-sprayed n-WC/12Co coating The X-ray diffraction method is the most popular one for directly measuring residual stresses.
Online since: November 2021
Authors: Nguyen Huu Loc
In terms of tool wear and bluntness, there has been a number of researches taking account into the physical nature of cutting tools, - providing basis for selection of cutting tools apart from clarification of the current pattern of tool wear and bluntness.
The tool is sharpened on the 3E642 tool grinder with a fine-grained grinding wheel, followed by smoothening with diamond powder.
Number of measurements n for a cutting length L is 5 and initial linear wear A0=6.5mm.
Experimenting results - chukrasia wood with 8Cr6NiVTi cutting tool material Tooltip radius r with different cutting length L [m] 5 250 1250 3250 6250 8000 Number of measurements 16 16 15 24 23 26 Mean of tooltip radius 4.05375 6.99125 9.43133 12.1417 14.8357 16.1065 Variance of tooltip radius 0.291 0.416 0.517 0.599 0.647 0.685 In the process of the experiment, depending on the milling tool tip radius r on the cutting length L we acquired with different iterations.
Then we obtained m variance s12, s22,…, sm2 with the different number of samples n1, n1,…, nm (Table 3).
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