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Therefore, when the grid is divided in the scanning area and its vicinity were regional breakdown, but far away from the region where the grid can draw too thick, which can significantly reduce the number of units, saving computing time.
After heating, cooling system make the workpiece temperature drop rapidly,which make the surface of the metal grains did not grow up, which can get a uniform dense surface structure.

The weakest magnetic component Sn(3) (Fig. 1), which is not observed in the spectra at higher temperatures, can be assigned to Sn4+ cations stabilized in any of the magnetic impurity phases, which was not detected in the X-ray diffraction pattern, or located at the surface of manganite grains.
Assuming that the magnetic moments of the Mn4+ and Cu2+ ions are collinear [4] for the manganite under consideration, we can express its reduced overall magnetization s(Т) through the reduced magnetizations and of the corresponding sublattices: , (2) where and are the numbers of the manganese and copper atoms per formula unit.

Since this process increases the LDR a part can be made in fewer numbers of steps and hence tool costs are also lowered.
At high temperatures grain growth phenomenon takes place that adversely affects the mechanical properties and surface roughness of the product [2].

Thus, how to develop effective electrochemical solution and addictive for electrochemical polish method in the semiconductor process of deep submicron becomes a great challenge[4-5] of universal planarization technology, thus there have been a number of research concerning this topic.
The wafers surfaces were rubbed down gradually with SiC sandpaper, polished with alumina powder of grain sizes of 1.0μm, 0.3μm, and 0.05μm.

Introduction Since amorphous alloys in Fe-metalloid system were found to exhibit good soft magnetic properties in 1974 [1-3], a large number of studies on the development of soft magnetic amorphous alloys have been carried out for the subsequent twenty years.
On the other hand, as a newly developed rapid sintering technique, the spark plasma sintering (SPS) has a great potential for achieving fast densification results with nearly no crystallization for amorphous materials or minimal grain growth for crystalline materials in a short sintering time [8].

There are numbers of articles about lead nitrate or thiourea as stabilizer but only few articles about thallium salts as stabilizer.
Surface morphology of the common Ni-B coating presents crowded flat grains and the surface is not too rough, surface morphology of the Ni-Tl-B coating presents crowded spheres which becomes big and rough with the changing content of thallium salt.

In the number, fine tailings accounted for 10~15%, including iron oxide in 2~3%.
Change these fine tailings in particle size and compare products, with thicker grain; And thick tailings comparison, and fine.

Two limiting cases can be observed: instantaneous nucleation, were all nuclei are formed immediately after the potential step; and progressive nucleation, where the number of nuclei increases during the whole deposition process.
We believe that this sample is too thin and is made of small randomly oriented grains, thus no diffraction peaks could be detected.

Annealing is the process of recrystallization which helps to reduce the surface state of grain and makes the crystallization of samples more completely.
It can reduce the number of nonradiative deathnium center and help to enhance luminous radiation of band edge transition.

HAP CAP Specific surface area [m2 /g] 60.01 53.38 Ca/P ratio 1.7 1.8 Carbon content [wt%] - 4.597 4008001200 1600 2000 2400 2800 3200 3600 4000 Wave number (cm -1 ) %Transmission (arbitrary units) HAP CAP Fig. 2.
TEM results (Fig. 5) show that CAP possessed more lattice defects, primarily in the form of grain boundaries, and hence a higher surface energy.