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Therefore, the manufactured prototypes have different properties.
The parts were oriented so that the support material does not negatively affect the quality of the prototype function surfaces.
Imperfect edges are a property of 3D printing.
When compared to the current manufacturing methods, in this case, there is a significant time-saving factor in manufacturing the whole set and even the matrix alone.
The least financially demanding is to manufacture the whole set by means of FDM technology using ABS material, making a good trade-off between the material price and its mechanical properties.

Considering high levels of visual impairment that greatly affect the quality of life, an estimated 40 to 45 million people are blind and 135 million have a low vision [2].
This is a very worrying factor that exposes the fragility of the solutions created when using a system, which most visually impaired people cannot interpret.
Creativity and design activities can be affected by several practical factors, such as consumer, presentation, product, trend forecasting, cost, technology, research, planning, designing and finally selling [42].
Filafresh®, now converted into 4D® product, is a flexible 3D filament based on TPU 96A with excellent physical and mechanical properties, developed with natural additives with personalized aromas, associated with the respective colours promoting synesthesia.
The difference in the chosen odour intensities was also a factor in the balance of odours so that the impact of changing intensities on the samples could be perceived.

Constitutive models are usually based on analytical equations, with parameters identified through mechanical testing.
They represent the Taylor factor of a crystallite with orientation g submitted to the strain mode a.
The average Taylor factors are then obtained as follows from the texture, using the orientation distribution function (ODF): ( ) ( ) ( )∫= dggfgMM , a a (7) These integrals can be evaluated very efficiently using the series expansion method [8].
The first effect can be implemented in the model by making the scaling factor τ c a function of the strain history.
However, it is still not possible to perform quantitative and truly predictive simulations of the rolling textures of aluminium alloys in which special metallurgical factors such as second phase constituents or shear banding plays a dominant role.

The impact of dislocation diffusion can be either beneficial or detrimental, depending on the effect of the segregation on material's properties.
Mechanical alloying.
The latter depends not only on Dv but also on the vacancy occupation probabilities (concentrations) at various core sites, as well as on the partial jump-correlation factors.
It accurately reproduces a number of properties of Al, including elastic constants, phonon frequencies, the intrinsic stacking fault energy and others.
We use thermal expansion factors computed in [70].

However the grinding marks and central dimples induced in grinding are hard to eliminate by chemical mechanical polishing even with a large amount of material removal and have significant impact on site flatness and nanotopography, and have been a great obstacle for the manufacture of ultra-flat wafers [2, 3].
Finally, the diamond grinding wheel is a mixture of grain particles and bond material, the dissimilar optical properties may be a major limiting factor to some optical based 3D surface profilers.
The fact that there exist waves on both the wheel surface and the ground wafer surface indicates that there exists regenerative effect in the wafer grinding system, since a characteristic feature of grinding chatter due to regenerative effect is that it possibly affects both the workpiece and the grinding wheel surface [8].
A central dimple is usually generated in the vicinity of the center of the ground wafer of the order of 2 to 30mm in diameter and of the order of 0.2 to 0.5μm in depth due to excess material removal in the center region, which is hard to remove by chemical mechanical polishing [3].
Kang, et al: Frontiers of Mechanical Engineering in China (In press)

Introduction Outstanding properties of SiC (wide bandgap, high electric and mechanical strength, high thermal conductivity and stability, and high radiation resistance) make this material suitable for fabrication of high-power and high-frequency devices or electronics operating at high temperatures and radiation levels.
Deep levels with similar properties as E1 and E2 were already registered in 4HSiC irradiated with 8.6 MeV electrons [3].
The level EA3 exhibits similar properties as the center EH5 detected in electron or proton irradiated 4HSiC after the annealing at 300°C [5,6].
On the other hand, the ideality factor of the JBS diode varies only slightly from 1.029 (unirradiated diode) up to 1.048 (1x1015 electrons cm-2).
Also the diode’s blocking voltage is not affected by electron irradiation.

In addition, instrumented techniques probe a small volume of material, allowing for the determination of local properties and small volumes of materials (such as single grains, phases or thin films).
Unloading curve: analysis with the Oliver & Pharr method (1992): Most of the methodologies for evaluation of mechanical properties relay in the analysis of the unloading portion of P-h curves.
This last parameter may affect to a large extent the correct evaluation of the mechanical properties of hard materials, as it captures not only the lack of axisymmetry of the indenter but also the radial displacements of the material [3].
It has to be taken into account that the model of choice depends on the relative mechanical properties of the coating and the substrate, particularly their relative ductility and stiffness.
Conclusions Instrumented indentation is a powerful technique to extract material properties at very low scales, once correctly calibrated.

These achievements have been possible only thanks to an integrated approach used to solve in advance any manufacturing criticality which would have affected the cost and delayed development time.
Deformation occurring in forming process changes the property of the material altering its behaviour during crash.
The idea of the DA method is to use the shape deviation between the deep drawn product and the desired shape, multiplied with a negative factor, as a compensation function for the geometry of the tools.
The greatest limit of this kind of analysis is the assumption of considering all the mechanical parts as rigid.
Concerning new vehicle architectures based on multi-material approach, an example of key assembly technology is bonding process, whose development allows to continuously join different material through the use of adhesives with suitable mechanical strength, according to the subcomponent mission (Crash, NVH, …); such a technology is at present exploited with high accuracy on the control of the amount and shape of adhesive deposited to solve the geometrical gap created in the joining phase due to dimensional tolerances management.

Over the time of usage, circuit breakers eventually experience some degradation process, which affect integrity of both mechanical and electrical functions.
Circuit Breaker Mechanism and Features of Trip Coil Profile The electromechanical property of the switchgear allows for the trip coil to act as a circuit breaker profiler [1], where the current fluctuations can be represented graphically for analysis.
This indicates that the plunger, which is targeted towards hitting the latch of the spring mechanism, overcomes the mechanical resistance and the effect of ‘stiction’ in order to be in motion.
Therefore, the design of switchgear plays a crucial factor in implementing ERA.

These ligands and their complexes show excellent properties in light, electricity, magnetism, molecular vehicle and catalytic properties.
The following conclusions can be drawn from the table 2: The luminous properties of rare earth β-diketone complexes are related to the groups R1 and R2, and the electron-giving characteristic of R1 and R2 are important factors affecting the luminous efficiency of Eu3+.
The results show that the quenching between metal electrodes is an important factor affecting the device efficiency and brightness.
Photophysical properties of novel organic europium(III) complexes[D].
Preparation and properties of Eu(III) complexes with carboxylic of oxids[D].