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Creep age formability of friction stir welded 2A12 aluminum alloy structures Dahai Liu1, a, Junchu Li1,b and Chun Chang1,c 1 School of Aeronautical Manufacturing Engineering, Nanchang Hangkong University, Nanchang 330063, China aliudahai@nchu.edu.cn, bli_junchu@163.com, ccchun66@163.com Keywords: Aluminum Alloy, Creep Age Forming, Integral Panel, Friction Stir Welding Abstract.
Large integral panels are the main structure parts of the modern advanced civil airplanes, for which, creep age forming is one of the cost-effective forming processes [1-3].
Aerospace Engineering Vol. 222 (2008), p. 873 [2] L.H.
Forum Vol. 28 (2004), p. 202 [4] M.C.

Cho 1 1 School of Materials Science and Engineering, College of Engineering, Inha University 253 Yonghyun-Dong, Nam-Gu, Inchon 402-751, Korea 2 Advanced Welding & Joining Technology Team, Korea Institute of Industrial Technology 994-32, Dongchun-Dong, Yeonsu-Gu, Incheon 406-130, Korea a ldm0922@kitech.re.kr, bchlim95@dreamwiz.com Keywords: Bi2Te3; Thermoelectric; Seebeck effect; Peltier effect; Spark Plasma Sintering.
Forum Vol. 449-452 (2004), p. 907

1270V, 1.21mΩ·cm2 SiC Buried Gate Static Induction Transistors (SiC-BGSITs) Yasunori Tanaka1,a, Koji Yano2,b, Mitsuo Okamoto 1,c, Akio Takatsuka 1,d, Kazuo Arai1,e and Tsutomu Yatsuo1,f 1 Power Electronics Research Center (PERC), National Institute of Advanced Industrial Science and Technology (AIST), Central 2, 1-1-1 Umezono, Tsukuba, Ibraki 305-8568, Japan 2 Interdisciplinary Graduate School of Medical and Engineering, Yamanashi University, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan a yasunori-tanaka@aist.go.jp, byano@esd.yamanashi.ac.jp, cmitsuo-okamoto@aist.go.jp, d a-takatsuka@aist.go.jp, earai-kazuo@aist.go.jp, ft-yatsuo@aist.go.jp Keywords: 4H-SiC, BGSIT, JFET, on-resistance, breakdown voltage Abstract.
Kolar: 2nd ECPE SiC User Forum 2007 oral presentation [5] K.
Amaratunga: Microelectronic Engineering Vol. 83 (2006), P.107 [9] K.

Edwards1,2 1 Department of Material Engineering, Faculty of Technology, The Open University, Walton Hall, Milton Keynes, MK7 6AA, UK 2 Institute of Materials Engineering and Science, ANSTO, Menai NSW2234, Australia * Corresponding author: s.ganguly@open.ac.uk Keywords: Neutron diffraction, Reactor source, Residual stress, Welding Abstract.
The measurement was carried out at SALSA, the engineering strain scanner at the ILL, Grenoble, France.
Thus FE procedures are being applied with increasing frequency to predict residual stresses in welded engineering structures for structural integrity assessment purposes.
J.: Materials Science Forum; 2006; 524-525: pp. 217-222
E.: Materials Science Forum; 2006; 524-525: pp. 679-684.

Recent Patents on Mechanical Engineering 1 (2008): 65-67
Nanotechnological Basis for Advanced Sensors, NATO Science for Peace and Security Series B: Physics and Biophysics, Volume.
Journal of materials engineering and performance 20.4 (2011): 658-662
Materials Science and Engineering: A 419.1 (2006): 45-49
Materials Science and Engineering: A 481 (2008): 582-589

Experimental Study on Cutting Force and Cutting Power in High Feed Milling of Ti5Al5Mo5VCrFe Hui Suna, Hu Xiaob and Liang Lic * *College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016 China aamos-sun@foxmail.com, b56548493@qq.com, cliliang@nuaa.edu.cn Keywords: High Feed Milling, Cutting Force, Cutting Power, Titanium alloy Abstract.
Wang, Experimental evaluation of polycrystalline diamond (PCD) tool geometries at high feed rate in milling of titanium alloy TC11, International Journal of Advanced Manufacturing Technology. 77 (2015) 1549-1555
Zeren, Finite element modeling the influence of edge roundness on the stress and temperature fields induced by high-speed machining, International Journal of Advanced Manufacturing Technology. 35 (2007) 255-267
Sánchez, Advanced cutting conditions for the milling of aeronautical alloys, Journal of Materials Processing Technology. 100 (2000) 1–11
Zhang, Investigation of Cutting Force in High Feed Milling of Ti6Al4V, Materials Science Forum. 770 (2014) 106-109

A Numerical Simulation of Superplastic Double-sided Roll Forming of Discal Parts Quanlin JIN Advanced Manufacture Technology Canter, China Academy of Machinery Science & Technology, No.18 Xueqing Road, Beijing, 100083 P.R.China jinql@eforming.net Keywords: grain size prediction, double-sided roll forming, superplasticity, numerical simulation Abstract: A numerical simulation of superplastic double-sided roll forming of aluminium alloy discal parts is presented in this paper.
Journal of plasticity engineering, Vol. 14(2007), p.96 (in Chinese) [7] T.
Advanced Manufacture Technology Center China Academy of Machinery Science & Technology, 2006.
Liao: Numerical Simulation of Superplastic Forming and Its Microstructure Evolution, Materials Science Forum Vols. 447-448 (2004), p.183
Hai: Superplastic Constitutive Relation and Its Applications, In: Superplasticity in Advanced Materials, ICSAM.97, edited by A.H.

Herman, in: Thermal Spray: Practical Solutions for Engineering Problems, ed.
Forum, Vol. 442, (2003), p. 67
Forum, Vol. 442, (2003), p. 73
Fauchais, in: Thermal Spray: Advancing the Science and Applying the Technology, ed.

Arai, Silicon Carbide -- Recent Major Advances (Eds.
Forum, Vols. 433-436, p. 721 (2003)
Engineering, Vol. 70, p. 519 (2003)
Forum, Vols. 615-617, p. 573 (2009).

Quantified density of active near interface oxide traps in 4H-SiC MOS capacitors Hamid Amini Moghadam1,2,a *, Sima Dimitrijev1,2,b, Jisheng Han1,c, Amirhossein Aminbeidokhti1,2,d, and Daniel Haasmann1,2,e 1Queensland Micro and Nanotechnology Centre, Griffith University, Australia 2Griffith School of Engineering, Griffith University, Australia ahamid.aminimoghadam@griffithuni.edu.au, bs.dimitrijev@griffith.edu.au, cj.han@griffith.edu.au, damirhossein.aminbeidokhti@griffithuni.edu.au, ed.haasmann@griffith.edu.au Keywords: 4H–SiC, MOS capacitors, threshold voltage instability, capacitance–voltage shift.
Forum, 679 (2011) 366-369
Cooper, Advances in SiC MOS technology, physica status solidi (a), 162 (1997) 305-319
Forum, 778 (2014) 627-630