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Online since: October 2004
Authors: Kyu Hwan Oh, Jun Yun Kang, Dong Ik Kim, Hu Chul Lee
The hot band was cold rolled by 75% reduction, and then, as-rolled, partially, and fully recrystallized specimens were prepared from the cold rolled sheet.
Orientation distribution function (ODF) was calculated from the EBSD data by WIMV method [3].
This can be expected from the fact that the grains of {111}<110> orientation observed in this study have low aspect ratio of only about 2.4, while those of most grains should approach the value of about 16 due to the geometrical constraint of 75% rolling reduction.
Online since: July 2005
Authors: John J. Jonas, You Liang He, Stéphane Godet, Pascal J. Jacques
The orientation data for both the kamacite and taenite phases were then collected.
They were then cooled down to 1050°C in air and rolled to 50% reduction at this temperature.
{001} X Y Bain K-S N-W 124 further cooled down to 750°C and another 50% reduction was applied.
Online since: March 2007
Authors: Kanryu Inoue, Gon Seung Yang, Jong Kook Lee, Woo Yang Jang, Soon Jong Jeong
Therefore, in order to apply to mechanical and thermal materials, it is important to obtain the experimental data for a transformation under the loading, and physical properties, and slip resistant for repeated thermal cycling.
Also, the plate-specimen with the thickness of about 1mm (ratio of thickness reduction before and after a rolling is about 10% was prepared by the same method at 350˚C, which is induced to form an α phase, without the occurance of recrystallization.
Therefore, due to the increase of diffusion time, martensite particle are stabilized by atomic rearrangement and the reduction of free energy which raises the temperature of reversed transformation temperature.
Online since: March 2025
Authors: Hartini Ahmad Rafaie, Syuhada Mohd Tahir, Norsaidatul Amira Azmi
This data also tell us that dissociated ions from LiTFSI coordinated to all three sites, OH, C=O and C-O-C while ZnO only prefers to coordinate at O-H site, as illustrated in Figure 4 below.
Consequently, peak broadening and a reduction in intensity were observed.
The addition of a small amount of ZnO leads to enhanced ionic conductivity, evident in the shifted hydroxyl FTIR absorption peak to higher wavenumbers, and a reduction in peak intensity in XRD, indicative of improved amorphous characteristics.
Online since: February 2011
Authors: Xue Mei Wu, Tao Yu, Lan Jian Zhuge
Introduction In order to realize higher response speed and circuit density, lower power consumption, more reliable operation, the feature size of CMOS is aggressively downscaled following proportional reduction principle.
As Pt diffusing to the HfTaO interface, the reduction of depth in MOS capacitance occurred, which lead to decrease in Eot and increase in accumulation capacitance [22,24].
Excellent agreement with I-V experimental data is obtained under 1.75MV/cm.
Online since: December 2013
Authors: Md Radzai bin Said, M.M.H. Megat Ahmad, Mohd Yuhazri bin Yaakob, H. Sihombing, U. Nirmal, Teng Teng Tan Jennise
Introduction Utilization of laminated composite materials has become increasingly common in a wide range of structural components over conventional materials because of their superior specific properties; such as high strength and stiffness-to-weight ratio, improved corrosion and environmental resistance, design flexibility, improved fatigue life, potential reduction of processing, and life cycle cost [1,2].
From the data, SN4 (45˚) did not gave a good mechanical properties for the laminated composite to be cured at this angle as the behaviour of the composite will be changed sharply than control sample.
Wang [15] reported that delamination occurred between the fiber and matrix as well as fiber pulls out cause reduction in structural stiffness and strength, leading to growth of damage and final fracture as occurred in SN4 top when viewed under microscope as shown in Fig. 4(a).
Online since: January 2013
Authors: Jiang Rong Xiao, Ru Guang Li, Peng Yao, Sheng Yin Zhou, Kun Tian
In civilian applications, CEP can be used to shield electromagnetic radiation from the human body, purify environmental electromagnetic pollution, prevent data leakage from computer centers, avoid artifacts caused by bridges, towers and other large infrastructures.
The compressive strength, flexural strength and durability of cement-based are reduced through adding organic electromagnetic wave absorbing resonators, but significant reduction of the reflectivity is accompanied with the reduction of absorber strength at the same time, so organic electromagnetic wave absorbing resonators can not be used as a resonator.
Online since: June 2021
Authors: Sergey Usherenko, Yulia Usherenko, Viktors Mironovs
Currently, weight reduction of the construction in aerospace industry is one of the modern challenges.
This should provide a significant reduction in fuel costs when launching units into orbit and expand the functionality of spacecraft.
From the data given in Table 1, it is shown that the effect of dynamic alloying on the increase in hardness for Al 99.7 % is noticeable up to 100 mm, and for the Al – 12 % Si alloy to depths of 180 mm.
Online since: February 2004
Authors: Rustam Kaibyshev, T.G. Nieh, I. Kazakulov, D. Gromov, Donald R. Lesueur
The use of SPF can sometimes offer a great reduction in manufacturing cost.
As a result, a reduction in porosity volume fraction is observed at a higher temperature of 520 0C.
Comparing with cavitation data in tension [3] it is concluded that void growth is faster in biaxial test at higher forming rates.
Online since: September 2006
Authors: Emmanuel Girard, Ronald Guillén, Sylvain Fréour
This deviation can be attributed to either a shifting in machining conditions or data acquisition and treatment processing.
The analyse of the results for the longitudinal stresses (see figure 1) shows that the main factor managing the raising of compressive residual stresses is the temperature reduction during the matter removal process.
This is attributed to an augmentation of the cutting edge length in contact with the machined piece, combined to a reduction of chip thickness.
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