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When examining the changes of the crystal grain of drawn wire by EBSD (Electron Back Scatter Diffraction Patterns), it wasconcluded out that grain size was compressed by conventional drawn wire due to share deformation and for alternate drawn wire it was confirmed that it was possible to inhibit the grain shrinking by 15% compared to the conventional drawing method.
ECAP method is used to get ultra-fine metal grain that has a higher workability.
Also, the further suppression of work hardening is possible with the increase of the number of times reversing the drawing direction.
Grain size observation of drawn wire by EBSD analysis 　In this analysis, to investigate the crystal grain size and crystal grain orientation of conventional and alternate drawn wires, Electron Back-Scatter Diffraction (EBSD) analysis was used.
In Fig. 10 the grain size of conventional and alternate drawn wire is shown.

The detailed process parameters and numbers of specimens were in Table 2.
(b) (c) (a) Fig.3 Austenite structures after multi-pass deformation (a) 1#, (b) 2#, (c) 3# Comparatively, the austenite grain size after four-pass deformation is small and relatively uniform with an average intercept of 33.59um; the austenite grains after five-pass deformation had uneven sizes and some of the grains were abnormally coarse, leading to a lager average grain size.
But the austenite grain size was uneven and the average intercept was relatively big.
Therefore, for multi-pass deformation, with the same strain rate and controlled accumulated deformation, the grain size of recrystallization austenite is mainly determined by pass temperature and deformation of each pass, especially deformation during the first pass has more influence, while has little relationship with the number of passes.
The ultimate deformation stress is determined by ultimate deformation temperature and increases with the increasing number of passes.

Grain size.
Figure 2 is the macro grain degree photos of the Nimonic 90 alloy by different remelting casting into test specimens, grain size characteristics are shown in Table 3.
As a consequence, the number of nucleation rate increased, average grain size tended to be smaller and smaller, which ranged from 127μm to 15.9μm.
a)1# b) 2# c) 3# d) 4# Fig. 2 Macro-photographies of samples for different remelting processes Table 3 Grain grade of the Nimonic90 Serial number 1# 2# 3# 4# Grain size(μm) 120~130 60~70 30~33 14~17 Grain grade 3 5 7 9 Microstructure.
Same researches pointed out the number of the γ ' in superalloy usually increases with Al+Ti, and the Ti / Al ratio has little effect relative to the number of γ ' [6].

In Fig. 2, the pure TiO2 film has a continuous and uniform sheet microstructure and is composed of TiO2 nano-grains with an average grain size about 20nm.
They are likely the congeries of the rutile of TiO2 crystalline grains.
Nevertheless, the surface is rough because of these bigger grains.
The photo-catalytic activity depends strongly on the concentration of doping ions and the film layer numbers.
But the layer numbers are important as well.

Most of sulfides within grains were Cr2MnS4, while sulfides at grain boundaries were mainly FeS.
The number of spherical sulfides is then increased.
Fig.2 The morphology of sulfides in grain.
As the cooling rate was increased, more sulfides were found in grain rather than at grain boundaries.
The number of spherical sulfides is increased and the sulfides show a catenular distribution at grain boundaries. 3) The sulfides are easily fracturing and the microcrack are formed in the sulfides when the steel is stressed by force.

To meet low insertion loss requirement, a lower number of turns is required.
This fact was mainly attributed to that phosphorus ions with high electronic valence could increase cation vacancies in the grain boundary region, as a result, the speed of the grain boundary movement increased, thereby promoting grain size of the ferrites.
Due to the increased pores hindered grain boundary movements, enlarging trend of grain size became tardily as P2O5 addition exceeded 0.06wt%.
Hysteresis loss decreased with increasing grain size, which could be explained by the decrease of domain wall pinning factor, grain boundary, with increasing grain size [6].
Magnetic loss was also influenced by both grain size and porosity.

The affair number of transaction item set in data set is called supporting number, which is recorded as.
(2) Reducing the number of support degree computing, so the number is close to the frequent itemsets number
(3) Using the number of sub itemsets to get the maximum decomposition
Granular computing table Grain Information grain Binary system Grain size [A] {002,004} 10100000 2 [B] {001,004,005,007,008,009} 1E+08 6 [C] {003,005,006,007,008,009} 1011111 6 [D] {001,002,003,004,006,008,009} 1.11E+08 7 [E] {001,008} 1E+08 2 From the table we can see, all the grain size reaches the minimum support degree, so they usually are one group.
Two groups of frequent item set table after granular computing Grain Information grain Binary system Grain size [A] {002,004} 10100000 2 [B] {001,004,005,007,008,009} 1E+08 6 [C] {003,005,006,007,008,009} 1011111 6 [D] {001,002,003,004,006,008,009} 1.11E+08 7 [E] {001,008} 1E+08 2 The number of itemsets is obtained by the new frequent itemsets combination: [B,C,D], [B,C,E], [B,D,E].

It was equiaxed or dendrite structure with grain size of 20～40μm.
Ti and C distribute evenly along grain boundaries and grains.
Grain refiner can refine grains and improve ingot quality, so it is an indispensable key material in aluminum casting[5-7].
Primary grain size ranges between 10~200μm.
Development of Al-Ti-C grain refiners containing TiC.

The result showed that it had excellent grain refining performance for commercially pure aluminum in 800˚C.
So far, AlTiB master alloy is still the most commonly used grain refiner in Al and Al alloys [3].
Research has shown that, AlTiC master alloy is considered as the most promising grain refiner of Al and Al alloy[6].
(a) 740˚C (b)800˚C (c)900˚C Figure 5 Refinement picture Figure 5 shows, AlTiC master alloy prepared at 800 ℃ has the best refinement, all of equiaxed grain, size can reach an aluminum (average grain size 0.026mm2) requirements; at 740 ℃, the temperature is low, refinement of AlTiC is bad, most of columnar crystals; at 900 ℃, the temperature is high, morphological of TiAl3 in the AlTiC master alloy changed, lowered refining effect, the center sites were equiaxed, columnar grain edges.
Reif, Development of Al-Ti-C grain refiners containing Tic.

The average grain radius is about 1µm. 3D Voronoi tessellations usually include large numbers of relatively small entities such as small Voronoi grid edges and faces which can result in a refined mesh.
The mesh refinements can increase the total number of elements and significantly increase the time needed for explicit computation.
Because the crystallographic grain orientations are random, grain will show elastic anisotropy [4].
Some cohesive elements are embedded into grains; others are embedded along grain boundary.
Kgrain and Kgb denotes the K value of grain and grain boundary respectively.