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Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing Hong Gao1, a and Jianxiu Su2, b 1 Guizhou University, Guizhou, Guiyang 550025, China 2 Henan Institute of Science and Technology, Xinxiang 453003, China a deutschgao2009@163.com, bjxsu2008@people.com.cn Keywords: CMP, Material removal mechanism, Polymer materials, Polishing pad, Surface characteristics Abstract.
The polishing pad used in the manufacture of integrated circuits is mainly polymer materials and the main component is the polyurethane foam.
Kang, et al : Materials Science Forum, Vols. 471-472 (2004), p. 26-31 [3] J.X.
Abhijit: Journal of Electronic Materials, Vol. 30 (2001), p. 400-408 [7] S.
Meade, et al: Journal of Tribology, Vol. 122 (2000), p. 539-543 [8] G.H.

Thixoforming technology normally uses aluminum-silicon alloys such A356 and A357 as raw materials.
Young, Rheocasting, Materials Science and Engineering, Vol. 25. (1976). pp. 103-117
Nomura, Effect of semi-solid processing on solidification microstructure and mechanical properties of gray cast iron, Materials Science and Engineering A, V. 417A, (2006), pp. 166-173
Nofal, Microstructure, fluidity, and mechanical properties of semi-solid processed ductile iron, Journal of Materials Science, V.
Zoqui, Thixoformability of hypoeutectic gray cast iron, Journal of Materials Processing Technology, V. 212, (2012). pp. 1225-1235

The Experiment of the Performance of Interior Moisture Buffering Materials The experiments of the performance of moisture buffering materials follow the instruction of JIS A1470-1:2008 standard at daily cycle (12-hour adsorption, 12-hour desorption) mainly for building materials such as interior materials in response to humidity variation (Figure 1).
In this study, the researchers picked 7 different materials, both granular and plate, which are all local building and interior materials in Taiwan, except moisture buffering tiles (Table 1, 2, and Figure 2).
Testing Interior Moisture Buffering Materials (Upper row is the plate materials; lower row is the granular materials) The study of typical residential buildings in Taiwan Table 2.
For now, the study completed 6 local materials and also 1 imported material (moisture buffering tile) as a comparison.
J., “Airborne micro-organisms: Survival tests with four viruses”, the Journal of Hygiene, Vol. 59, No. 4: 479-486, 1961

The device is almost suitable for all materials.
The device is almost suitable for all materials.
Dripke: Advanced materials & Processes.
Vol. 49(B12)(2009), p.44-46. in Chinese [6] Zenxiang Fu, Jize Shi, Shichun Wu: Journal of Materials Processing Technology.
Ohmia et al: Journal of Nuclear Materials.

As a word, heavy metal Hg resistance of YK is lowest in five materials, but resistance of FX was higher than other materials.
Materials and methods Site and materials description.
Journal of Lake Sciences, Vol. 2 (2001), p. 163-168
International Journal of Molecular Sciences, Vol. 3 (2002), p. 965-984
Southwest China Journal of Agricultural Sciences, Vol. 23 (2010), p. 119-122

One such innovative approach involves incorporating these waste materials into construction materials, primarily concrete.
Advances in Materials Science and Engineering,(2018), p. 1-8
Materials, 14(9), (2021), p.2337
Construction Materials, 1,(2021), p. 39-62
Advances in Material Science and Engineering, (2021), p. 265-272

Application of IR spectroscopy in WPC Matrix materials.
Filling materials.
The waste materials and branches of wood and bamboo, annuals and crops are the filling materials of WPC.
The shape of the filling materials can be fiber and chip.
Supplementary materials.

Analysis on the characteristics of transient signal transmission based on GaAs materials Wei Liu1, a and Tian Lan2 1Department of Physics, Capital Normal University, Beijing 100048, China 2School of Opto-Electronic Engineering, Beijing Institute of Technology, Beijing 100081, China alwei263@263.net Keywords: GaAs semiconductor, Photoconductive switch, Ultra fast, Transmission model, Time resolution Abstract.
It is made up of the materials with high density of imperfection and extremely short carrier lifetime, including low temperature GaAs (LT-GaAs) and semi-insulating GaAs (SI-GaAs) etc, which make the photoconductive switch works in the range from nanoseconds to picoseconds.
Acknowledgment This work was financially supported by the following funds: (1) the Natural Science Foundation of China (No. 60772064); (2) the Beijing educational committee science and technology project (No.KM200810028007).
[5] Wei Shi and Li-qiang Tian: Chinese Journal of Semiconductor.
[9] Guo-you Ma, Tian Lan and Yin-chao Zhang: CHINESE JOURNAL OF LASERS.

Packing problem, which occurs frequently in sheet metal, clothing and furniture industry, cut product patterns from raw materials most efficiently and maximize material utilization.
Baltzer AG, Science Publishers, Basel, Switzerland, p.313–325 [3] V.
Jakobs: European Journal of Operational Research Vol. 88 (1996), p.169-171 [5] J.
Turton: European Journal of Operational Research Vol.128 (2001), p.34–57 [7] A.
Oliveira: European Journal of Operational Research Vol.141 (2002), p. 365-368 [8] E.

Effect of Infill Density and Printing Patterns on Compressive Strength of ABS, PLA, PLA-CF Materials for FDM 3D Printing Thanh-Dung Do1,a, Manh-Cuong LE1,b, Tuan-Anh NGUYEN2,c and Thai-Hung LE1,d* 1School of Materials Science and Engineering, Hanoi University of Science and Technology (HUST), Hanoi, Vietnam 2Vietnam Standards and Quality Institute, (VSQI), Hanoi, Vietnam adung.dothanh@hust.edu.vn, bcuong.lm167090@sis.hust.edu.vn, canhnt.vsqi@gmail.com, d*hung.lethai@hust.edu.vn Keywords: 3D printing, FDM, ABS, PLA, PLA-CF, printing patterns, infill density, compressive strength.
Materials and Experimental Procedures There were three types of chosen materials supplied by Flashforge USA, Inc.
International Journal of Lightweight Materials and Manufacture Volume 3, Issue 3, September 2020, Pages 284-297
International Scientific Journal Machines.
Materials.